QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 1
HP Pro Mini 400 G9 Desktop PC
Type-C® SuperSpeed USB 20Gbps signaling rate port
(charge support up to 5V/3A)
4.
Combo Audio Jack with CTIA and OMTP and headset
support
Type-A SuperSpeed USB 10Gbps signaling rate port
5.
Dual-state power button
Type-A SuperSpeed USB 10Gbps signaling rate port (charge
support up to 5V/1.5A)
6.
Hard drive activity light
Not shown
(2) M.2 (1 as M.2 2230 socket for WLAN/Bluetooth® and 1 as
M.2 2280 socket for storage)
(1) 2.5" internal storage drive bay
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 2
HP Pro Mini 400 G9 Desktop PC
2x Dual Mode DisplayPort™ 1.4a(DP++)
7.
Type-A SuperSpeed USB 10Gbps signaling rate port
HDMI 2.1
8.
Flex Port 2
2
, choice of:
2x Type-A SuperSpeed USB 5Gbps signaling rate port
(Supporting wake from S4/S5 with keyboard/mouse
connected and enabled in BIOS)
• 2x Type-A Hi-Speed USB 480Mbps signaling rate port
• Serial
• 2
nd
External Antenna
Cover release thumbscrew
9.
RJ45 network connector
Standard cable lock slot (10 mm)
10.
External WLAN antenna opening
2
Flex Port 1, choice of:
11.
Power connector
• DisplayPort™1.4a with HBR3
• HDMI 2.1a
• VGA
• Serial
1
12.
Retractable Padlock loop
• Type-C® SuperSpeed USB 10Gbps signaling rate port w/
DisplayPort™ Alt mode and power intake via Type-C®
Power Delivery up to 100W
Not shown
Slots
(1) Internal M.2 2230 connector for WLAN
(1) Internal M.2 SSD storage 2280 connector
Mounting
Support for
- Dual VESA Sleeve V4 Standalone
-Quick Release Bracket
- B200/B300/B500/B550/B560/B600 Mounting bracket
- Integrated Work Center Stand
- HP Single Monitor Arm
1. Sold separately or as an optional feature.
2. Must be configured at time of purchase.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 3
HP Pro SFF 400 G9 Desktop PC
Slim optical drive (optional)
5.
SD card 4.0 reader (optional)
(1) Type-C® SuperSpeed USB 10Gbps signaling rate port
6.
Combo Audio Jack with CTIA and OMTP and headset
support
(1) Type-A SuperSpeed USB 10Gbps signaling rate port
7.
Dual-state power button
(2) Type-A SuperSpeed USB 10Gbps signaling rate port
8.
Hard drive activity light
Not shown
(1) PCI Express x16
(1) PCI Express x1
(2) M.2 (1 as M.2 2230 socket for WLAN/Bluetooth®
1
and 1 as M.2 2280 socket for storage)
1. Must be configured at time of purchase.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 4
HP Pro SFF 400 G9 Desktop PC
1.
External antenna (optional)
7.
RJ45 network connector
2.
Audio line-in/line-out connector
8.
(2) Type-A Hi-Speed USB 480Mbps signaling rate port
(Supporting wake from S4/S5 with keyboard/mouse
connected and enabled in BIOS)
3.
Dual-Mode DisplayPort™ 1.4a (DP++)
4.
External antenna (option 1)
9.
(3) Type-A SuperSpeed USB 5Gbps signaling rate port
5.
HDMI 1.4b
10.
Internal WLAN antenna cover (optional)
6.
Flex Port, choice of:
11.
Standard cable lock slot
• DisplayPort™1.4a
• HDMI 2.1
• VGA
• Serial
12.
Serial Port (Optional)
13.
Integrated accessory cable lock
• Dual Type-A SuperSpeed USB 5Gbps signaling rate
• Type-C® SuperSpeed USB 10Gbps signaling rate with
DisplayPort™ Alt mode
14.
Power cord connector
Not shown
Port
Bay
Optional PS/2 (2 ports) & serial port card
1
(connected with
mainboard via flyer cable)
(1) 9.5mm internal optical drive bay
(1) 3.5" internal storage drive bay
Optional parallel port
1
Optional 4 Serial Port PCIe Card
1
(1 to 4 serial port dongle)
1. Each of the legacy options will occupy one rear slot.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 5
HP Pro Tower 400/480 G9 PCI Desktop PC
1.
Slim optical drive (optional)
5.
Front FlexIO Dual USB module (Option)
2.
Hard drive activity light
6.
(2) Type-A SuperSpeed USB 10Gbps signaling rate port
3.
Dual-state power button
7.
(1) Type-A SuperSpeed USB 10Gbps signaling rate port
4.
Combo Audio Jack with CTIA and OMTP headset support
8.
(1) Type-C® SuperSpeed USB 10Gbps signaling rate port
Not shown
PCI Express x16
(1) PCI Express x1
(1) PCI x1
(2) M.2 (1 as M.2 2230 socket for WLAN/Bluetooth®/storage
1
and 1 as M.2 2280 socket for storage)
1. Optional
2. SD card and front flex port can only select one at the same time
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 6
HP Pro Tower 400/480 G9 PCI Desktop PC
1.
External WLAN antenna (select products only)
7.
(3) Type-A SuperSpeed USB 5Gbps signaling rate port
2.
Audio line-in/line-out connector
8.
Power cord connector
3.
Dual-Mode DisplayPort™ 1.4a (DP++)
9.
Internal WLAN antenna cover (optional)
4.
HDMI 1.4b
10.
Internal WLAN antenna cover (optional)
5.
Flex Port, choice of:
11.
RJ45 network connector
• DisplayPort™1.4a
• HDMI 2.1
• VGA
• Serial
12.
Serial port (optional)
13.
Integrated keyboard/mouse wire hoop
• Dual Type-A SuperSpeed USB 5Gbps signaling rate
• Type-C® SuperSpeed USB 10Gbps signaling rate with
DisplayPort™ Alt mode)
14.
Pad lock
15.
Standard cable lock slot
6.
(2) Type-A Hi-Speed USB 480Mbps signaling rate (Supporting
wake from S4/S5 with keyboard/mouse connected and
enabled in BIOS)
Not shown
Port
Bay
Optional PS/2 (2 ports) & serial port card (connected with
mainboard via flyer cable)
1
(1) 9.5mm internal optical drive bay
(2) 3.5” internal storage drive bay
Optional parallel port
1
Optional 4 Serial Port PCIe Card
1
(1 to 4 serial port dongle)
1. Each of the legacy options will occupy one rear slot
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 7
HP ProOne 440 23.8 inch G9 All-in-One Desktop PC (Touch/Non-Touch)
1.
Pull-up webcam (optional)
6.
Power button
2.
Combo Audio Jack with CTIA and OMTP headset support
7.
Power activity light
3.
Speakers (optional)
8.
Type-C® SuperSpeed USB 10Gbps signaling rate port (charge
support up to 5V/3A)
4.
SD media card reader (optional)
5.
On-screen display (OSD) buttons
9.
Type-A SuperSpeed USB 10Gbps signaling rate port (charge
support up to 5V/1.5A)
5MP webcam with Temporal Noise Reduction (optional)
5MP webcam with Temporal Noise Reduction + IR Sensor + Color
Light Sensor (optional)
1.
Dual microphones
1.
Dual microphones
2.
Webcam light
2.
Webcam light
3.
5MP webcam
3.
IR/5MP/CLS webcam
4.
IR light
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 8
HP ProOne 440 23.8 inch G9 All-in-One Desktop PC (Touch & Non-Touch)
1.
Pull-up webcam (optional)
6.
(2) Type-A SuperSpeed USB 5Gbps signaling rate port
(Supporting wake in from S4/S5 with keyboard/mouse
connected and enabled BIOS)
2.
Optical disc drive (optional)
3.
Standard cable lock slot
7.
Dual-Mode DisplayPort™ 1.4 (DP++)
4.
Flex Port, choice of:
8.
RJ45 network connector
• DisplayPort™ 1.4a
• HDMI 2.1a
• Serial Port
• Type-C
9.
(2) Type-A SuperSpeed USB 10Gbps signaling rate port
10
Power connector
5.
HDMI-in 1.4b
1. Availability may vary by country
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 9
AT A GLANCE
• Choice of four form factors: Tower, Small Form Factor, Mini Desktop and All-in-One.
• Latest commercial class Intel® Q670 chipsets supporting Intel® Core™ 12
th
, 13
th
and latest 14
th
Generation processors,
featuring both integrated Intel® UHD Graphics and optional discrete graphics.
• Choice of Windows 11 Professional, Windows 11 Home, and FreeDOS.
• Hardware feature highlights:
o All Form Factors:
▪ Up to 64 GB DDR5 Memory, Max Speed up to 4800 MT/s (and up to 5600 MT/s on TWR and SFF) with
selected Intel® Core™ 14th Gen i5 & i7 Processors.
▪ Integrated 10/100/1000 Ethernet Controller, with optional Wi-Fi 6E, Wi-Fi 6 (802.11ax) and Wi-Fi 5
(802.11ac) and Bluetooth®.
▪ TUV Ultra Low Noice Certification on selected configuration.
o TWR/SFF:
▪ Multiply video outputs via 2 standard video ports, optional Flex IO and discrete graphics.
▪ Rear Flex IO choices of Serial, VGA, DisplayPort, HDMI & USB Type-C® with DisplayPort™ Output.
▪ Total 9 USB ports including 8 USB-A and 1 USB Type-C®
o Mini
▪ Configurable FlexPort which provides the following choices: HDMI 2.1, Serial, VGA, DisplayPort™ 1.4a, or
USB Type-C® with DisplayPort™ 1.4 with Power Delivery and Dual USB Type-A.
▪ 2
nd
FlexPort available for configuration with the following ports: Serial, Dual USB Type-A, and 2
nd
external
antenna.
▪ Single cable scenario support when configured with FlexPort USB Type-C® with DisplayPort™ 1.4 with
Power Delivery via selected HP monitors.
▪ Total 10 USB ports including 9 USB-A and 1 USB Type-C ® when configured with both FelxPorts in USB
offering.
o AiO:
▪ Audio with HP Noise Cancellation Software, HP Dynamic Audio, and HP Sound Calibration.
▪ Enhanced video conferencing experience with HP Auto Frame, HP Keystone Correction, Auto Camera
Select, and Backlight/Lowlight Adjustments.
▪ Multicamera software support of an additional webcam (optional) (sold separately).
▪ HP Eye Ease TÜV Certified Integrated Low Blue Light panels.
▪ Optional 23.8” FHD touchscreen with micro-edge bezel.
▪ Optional 5MP pull-up camera with options for Temporal Noise Reduction, IR sensor, and Color Light
sensor.
▪ HDMI-in enabled Monitor Mode which disassociates panel from CPU for use as strictly display only.
▪ Rear Flex IO choices of Serial, DisplayPort, HDMI & USB Type-C® with DisplayPort™ Output.
• Sustainability:
o ENERGY STAR® certified. EPEAT® Climate+ registered where applicable.
o High efficiency energy saving power supply and external power supply adapters.
o Recycled metals, low halogen & ocean bound plastics used in materials.
o 100% sustainably sourced and recyclable package.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 10
• TCO edge for AiO & TCO 9.0 for TWR/SFF/Mini.Software, Security & Manageability
o Optional vPro Enterprise and Essentials
o HP Wolf Security for Business includes HP Sure Click and HP Sure Sense
o HP Tamper lock
o HP Connect
o HP BIOSphere
• Protected by HP Services, including limited warranty up to 1-1-1 (terms and conditions vary by country; certain restrictions
and exclusions apply); Care Packs available with up to 5 years Next Business Day Onsite Hardware Support.
• Power consumption of Desktop Mini PC varies per configuration, for the best user experience, please connect PC power
cord while using USB-C® cable via Super Speed USB Type-C® port in the rear side of the platform.
• Reduce clutter on Mini Desktop with single cable connection for power and video through USB Type-C® enabled displays
with the optional USB- Type-C® port w/ DisplayPort Alt Mode and power intake via USB Type-C® Power Delivery up to
100W; reduce desktop footprint with the DM mounted behind a USB-C™ enabled display.
1. MIL-STD H testing is not intended to demonstrate fitness for U.S. Department of Defense contract requirements or for military use. Test results
are not a guarantee of future performance under these test conditions. Accidental damage requires an optional HP Accidental Damage Protection
Care Pack.
NOTE: See important legal disclosures for all listed specs in their respective features sections.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 11
PRODUCT NAME
HP Pro Mini 400 G9 Desktop PC
HP Pro SFF 400 G9 Desktop PC
HP Pro Tower 400 G9 PCI Desktop PC
HP Pro Tower 480 G9 PCI Desktop PC
HP ProOne 440 23.8 inch G9 All-in-One Desktop PC
OPERATING SYSTEM
Preinstalled
Windows 11 Pro
1
Windows 11 Pro Education
1
Windows 11 Home - HP recommends Windows 11 Pro for business
1
Windows 11 Home Single Language - HP recommends Windows 11 Pro for business
1
Windows 11 Pro (Windows 11 Enterprise or Windows 10 Enterprise available with a Volume
Licensing Agreement)
1
FreeDOS
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware,
drivers, software or BIOS update to take full advantage of Windows functionality. Windows is automatically updated and enabled. High speed
internet and Microsoft account required. ISP fees apply and additional requirements may apply over time for updates.See
http://www.windows.com.
CHIPSET
Mini
SFF
TWR
AiO
Intel® Q670
X
X
X
X
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 12
PROCESSORS
Intel® 12
th
Generation Core™ Processors
Mini
SFF
TWR
AiO
Intel® Core™ i7-12700 Processor
1
65W
2.1 GHz base frequency
Up to 4.9 GHz max. turbo frequency with Intel® Turbo Boost
Technology
2
25 MB cache, 12 cores, 20 threads
Intel® UHD Graphics 770
Supports DDR4 memory up to 3200 MT/s data rate
Supports Intel® vPro® Technology and Intel® Stable Image
Platform Program (SIPP)
3
X
X
X
Intel® Core™ i7-12700T Processor
1
35W
1.4 GHz base frequency
Up to 4.7 GHz max. turbo frequency with Intel® Turbo Boost
Technology 3.0
2
25 MB cache, 12 cores, 20 threads
Intel® UHD Graphics 770
Supports DDR4 memory up to 3200 MT/s data rate
Supports Intel® vPro® Technology and Intel® Stable Image
Platform Program (SIPP)
3
X
X
Intel® Core™ i5-12600 Processor
1
65W
3.3 GHz base frequency
Up to 4.8 GHz max. turbo frequency with Intel® Turbo Boost
Technology
2
18 MB cache, 6 cores, 12 threads
Intel® UHD Graphics 770
Supports DDR4 memory up to 3200 MT/s data rate
Supports Intel® vPro® Technology and Intel® Stable Image
Platform Program (SIPP)
3
X
X
X
Intel® Core™ i5-12600T Processor
1
35W
2.1 GHz base frequency
Up to 4.6 GHz max. turbo frequency with Single P-core turbo
Technology
18 MB cache, 6 cores, 12 threads
Intel® UHD Graphics 770
Supports DDR4 memory up to 3200 MT/s data rate
Supports Intel® vPro® Technology and Intel® Stable Image
Platform Program (SIPP)
3
X
X
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 13
Mini
SFF
TWR
AiO
Intel® Core™ i5-12500 Processor
1
65W
3.0 GHz base frequency
Up to 4.6 GHz max. turbo frequency with Intel® Turbo Boost
Technology
2
18 MB cache, 6 cores, 12 threads
Intel® UHD Graphics 770
Supports DDR4 memory up to 3200 MT/s data rate
Supports Intel® vPro® Technology and Intel® Stable Image
Platform Program (SIPP)
3
X
X
X
Intel® Core™ i5-12500T Processor
1
35W
2.0 GHz base frequency
Up to 4.4 GHz max. turbo frequency with Single P-core Turbo
Technology
18 MB cache, 6 cores, 12 threads
Intel® UHD Graphics 770
Supports DDR4 memory up to 3200 MT/s data rate
Supports Intel® vPro® Technology and Intel® Stable Image
Platform Program (SIPP)
3
X
X
Intel® Core™ i5-12400 Processor
1
65W
2.5 GHz base frequency
Up to 4.4 GHz max. turbo frequency with Intel® Turbo Boost
Technology
2
18 MB cache, 6 cores, 12 threads
Intel® UHD Graphics 730
Supports DDR4 memory up to 3200 MT/s data rate
X
X
X
Intel® Core™ i5-12400T Processor
1
35W
1.8 GHz base frequency
Up to 4.2 GHz max. turbo frequency with Single P-core Turbo
Technology
18 MB cache, 6 cores, 12 threads
Intel® UHD Graphics 730
Supports DDR4 memory up to 3200 MT/s data rate
X
X
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 14
Mini
SFF
TWR
AiO
Intel® Core™ i3-12300 Processor
1
60W
3.5 GHz base frequency
Up to 4.4 GHz max. turbo frequency with Single P-Core
technology
12 MB cache, 4 cores, 8 threads
Intel® UHD Graphics 730
Supports DDR4 memory up to 3200 MT/s data rate
X
X
X
Intel® Core™ i3-12300T Processor
1
35W
2.3 GHz base frequency
Up to 4.2 GHz max. turbo frequency with Single P-Core
technology
12 MB cache, 4 cores, 8 threads
Intel® UHD Graphics 730
Supports DDR4 memory up to 3200 MT/s data rate
X
X
Intel® Core™ i3-12100 Processor
1
60W
3.3 GHz base frequency
Up to 4.3 GHz max. turbo frequency with Intel® Turbo Boost
Technology
2
12 MB cache, 4 cores, 8 threads
Intel® UHD Graphics 730
Supports DDR4 memory up to 3200 MT/s data rate
X
X
X
Intel® Core™ i3-12100T Processor
1
35W
2.2 GHz base frequency
Up to 4.1 GHz max. turbo frequency with Single P-core
Technology12 MB cache, 4 cores, 8 threads
Intel® UHD Graphics 730
Supports DDR4 memory up to 3200 MT/s data rate
X
X
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 15
Intel® Pentium® Processors
(For FY22 Mini 400, need to add Pentium/Celeron 35W
CPU)
Mini
SFF
TWR
AiO
Intel® Pentium® Gold G-7400 Processor
1
46W
3.7 GHz base frequency
6 MB cache, 2 cores, 4 threads
Intel® UHD Graphics 710
Supports DDR4 memory up to 3200 MT/s data rate
X
X
X
Intel® Pentium® Gold G-7400T Processor
1
35W
3.1 GHz base frequency
6 MB cache, 2 cores, 4 threads
Intel® UHD Graphics 710
Supports DDR4 memory up to 3200 MT/s data rate
X
X
Intel® Celeron® 6900 Processor
1
46W
3.4 GHz base frequency
4 MB cache, 2 cores, 2 threads
Intel® UHD Graphics 710
Supports DDR4 memory up to 3200 MT/s data rate
X
X
X
Intel® Celeron® 6900T Processor
1
35W
2.8 GHz base frequency
4 MB cache, 2 cores, 2 threads
Intel® UHD Graphics 710
Supports DDR4 memory up to 3200 MT/s data rate
X
X
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 16
Intel® 13
th
Generation Core™ Processors
Mini
SFF
TWR
AiO
Intel® Core™ i7-13700 processor with Intel® UHD Graphics 770
(P-core Max turbo frequency up to 5.1 GHz, up to 5.2 GHz with
Intel® Turbo Boost Technology
1
, 30 MB L3 cache, 16 cores) 65W
2
Supports Intel® vPro® Technology
3
X
X
X
Intel® Core™ i7-13700T Processor with Intel® UHD Graphics 770
(P-core Max turbo frequency up to 4.8 GHz, up to 4.9 GHz with
Intel® Turbo Boost Technology
1
,30MB cache, 16 cores) 35W
2.
Supports Intel® vPro® Technology
3
X
X
Intel® Core™ i5-13600T processor with Intel® UHD Graphics 770
(P-core Max turbo frequency up to 4.8 GHz, 24 MB cache, 14
cores) 35W. Supports Intel® vPro® Technology
X
X
Intel® Core™ i5-13500 processor with Intel® UHD Graphics 770
(P-core Max turbo frequency up to 4.8 GHz, 24 MB cache, 14
cores) 65W
2.
Supports Intel® vPro® Technology
3
X
X
X
Intel® Core™ i5-13500T processor with Intel® UHD Graphics 770
(P-core Max turbo frequency up to 4.6 GHz, 20 MB cache, 14
cores) 35W
2.
Supports Intel® vPro® Technology
3
X
X
Intel® Core™ i5-13400 processor with Intel® UHD Graphics 730
(P-core Max turbo frequency up to 4.6 GHz, 20 MB cache, 10
cores) 65W
2.
X
Intel® Core™ i3-13100 processor with Intel® UHD Graphics 730
(P-core Max turbo frequency up to 4.5 GHz, 12 MB cache, 4
cores) 65W
2.
X
X
X
Intel® Core™ i3-13100T processor with Intel® UHD Graphics 730
(P-core Max turbo frequency up to 4.2 GHz, 12 MB cache, 4
cores) 35W
2.
X
X
1. Multi-core is designed to improve performance of certain software products. Not all customers or software applications will necessarily
benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and
software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance.
2. Intel® Turbo Boost technology requires a PC with a processor with Intel® Turbo Boost capability. Intel® Turbo Boost performance varies
depending on hardware, software and overall system configuration. See www.intel.com/technology/turboboost for more information.
3. Intel vPro® requires Windows 10 Pro 64 bit or higher, a vPro supported processor, vPro enabled chipset, vPro enabled wired LAN and/or Wi-Fi
6E WLAN and TPM 2.0. Some functionality requires additional 3rd party software in order to run. Features of vPro® Essentials and Enterprise
vary. See http://intel.com/vpro.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 17
Intel® 14
th
Generation Core™ Processors
Mini
SFF
TWR
AiO
Intel® Core™ i7-14700 with Intel UHD Graphics 770 (1.5 GHz E-core base
frequency, 2.1 GHz P-core base frequency, up to 4.2 GHz E-core Max Turbo
frequency, up to 5.3 GHz P-core Max Turbo frequency, 33 MB L3 cache, 8 P-
cores and 12 E-cores, 28 threads), supports Intel® vPro® Technology
X
X
X
Intel® Core™ i7-14700T with Intel UHD Graphics 770 (0.9 GHz E-core base
frequency, 1.3 GHz P-core base frequency, up to 3.7 GHz E-core Max Turbo
frequency, up to 5.0 GHz P-core Max Turbo frequency, 33 MB L3 cache, 8 P-
cores and 12 E-cores, 28 threads), supports Intel® vPro® Technology
X
X
Intel® Core™ i5-14500 with Intel UHD Graphics 770 (1.9 GHz E-core base
frequency, 2.6 GHz P-core base frequency, up to 3.7 GHz E-core Max Turbo
frequency, up to 5.0 GHz P-core Max Turbo frequency, 24 MB L3 cache, 6 P-
cores and 8 E-cores, 20 threads), supports Intel® vPro® Technology
X
X
X
Intel® Core™ i5-14500T with Intel UHD Graphics 770 (1.2 GHz E-core base
frequency, 1.7 GHz P-core base frequency, up to 3.4 GHz E-core Max Turbo
frequency, up to 4.8 GHz P-core Max Turbo frequency, 24 MB L3 cache, 6 P-
cores and 8 E-cores, 20 threads), supports Intel® vPro® Technology
X
X
Intel® Core™ i3-14100 with Intel UHD Graphics 730 (3.5 GHz P-core base
frequency, up to 4.7 GHz P-core Max Turbo frequency, 12 MB L3 cache, 4 P-
cores, 8 threads)
X
X
X
Intel® Core™ i3-14100T with Intel UHD Graphics 730 (2.7 GHz P-core base
frequency, up to 4.4 GHz P-core Max Turbo frequency, 12 MB L3 cache, 4 P-
cores, 8 threads)
X
X
Intel® Core™ 300 with Intel UHD Graphics 710 (3.9 GHz P-core base
frequency, 6 MB L3 cache, 2 P-cores, 4 threads)
X
X
X
Intel® Core™ 300T with Intel UHD Graphics 710 (3.4 GHz P-core base
frequency, 6 MB L3 cache, 2 P-cores, 4 threads)
X
X
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 18
GRAPHICS
Integrated Graphics
Mini
SFF
TWR
AiO
Intel® UHD Graphics 770 (integrated on 12
th
, 13
th
& 14
th
gen Core i7, Core
i5-1x500 and Core i5-1x500T)
X
X
X
X
Intel® UHD Graphics 730 (integrated on 12
th
, 13
th
& 14
th
gen Core i3/i5-
1x400, i5-1x400T)
X
X
X
X
Intel® UHD Graphics 710 (integrated on Pentium® Gold, Celeron® and 300
series)
X
X
X
X
Optional Discrete Graphics Solutions
Mini
SFF
TWR
AiO
NVIDIA® GeForce® RTX 3050 8GB GDDR6 Graphics card
x
NVIDIA® T400 4GB Graphics Card
X
X
Intel® Arc A380 6GB GDDR6 Graphics card
X
AMD Radeon™ 6300M with 2 GB GDDR6 Graphics
X
AMD Radeon™ RX 6300 2GB GDDR6 Graphics card
X
X
1. Only available with the 12
th
Generation processors.
Adapters and Cables
Mini
SFF
TWR
AiO
HP DisplayPort™ Cable
X
X
X
X
HP DisplayPort™ to DVI-D Adapter
X
X
X
X
HP DisplayPort™ to HDMI True 4K Adapter
X
X
X
X
HP DisplayPort™ to VGA Adapter
X
X
X
X
HP USB to Serial Port Adapter
X
X
X
X
STORAGE
NOTE: Starting from November 1
st
, 2023, all shipments will require Windows to be installed when selecting a SSD.
HDD can only be configured as additional data drives and not as the boot drive.
3.5 inch SATA Hard Disk Drives (HDD)
Mini
SFF
TWR
AiO
1TB* 7200RPM SATA HDD
X
X
2TB* 7200RPM SATA HDD
X
X
2.5 inch SATA Hard Disk Drives (HDD)
Mini
SFF
TWR
AiO
1TB* 7200RPM SATA HDD
X
X
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 19
M.2 PCIe NMVe Solid State Drives (SSD)
Mini
SFF
TWR
AiO
256GB M.2 2280 PCIe NVMe SSD
X
X
X
X
512GB M.2 2280 PCIe NVMe SSD
X
X
X
X
1TB M.2 2280 PCIe NVMe SSD
X
X
X
X
256GB M.2 2280 PCIe NVMe Three Layer Cell SSD
1
X
X
X
X
512GB M.2 2280 PCIe NVMe Three Layer Cell SSD
X
X
X
X
1TB M.2 2280 PCIe NVMe Three Layer Cell SSD
X
X
X
X
2TB M.2 2280 PCIe NVMe Three Layer Cell SSD
X
X
X
X
256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
1
X
X
X
X
512GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
X
X
X
X
256GB M.2 2280 PCIe OPAL2 NVMe SSD
X
X
X
X
NOTE*: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for
Windows) of system disk is reserved for the system recovery software.
NOTE**: Storage DriveLock does not work with Self Encrypting or Optane based storage.
1. Only available with the 12
th
Generation processors.
Optical Disc Drives
Mini
SFF
TWR
AiO
HP 9.5mm Slim DVD-ROM Drive
1
X
X
X
HP 9.5mm Slim DVD Writer Drive
X
X
X
1. HD-DVD disks cannot be played on this drive. No support for DVD-RAM. Actual speeds may vary. Don’t copy copyright-protected materials.
Double Layer discs can store more data than single layer discs. Discs burned with this drive may not be compatible with many existing single-layer
DVD drives and players.
Media Card Reader
Mini
SFF
TWR
AiO
SD 4.0 with 5-in-1 Interface (Supports SD, SDXC, SDHC, UHS-I, UHS-II)
X
X
SD 3.0 with 4-in-1 Interface (Supports SD, SDXC, SDHC, UHS-I)
X
MEMORY
Mini
SFF
TWR
AiO
DDR4-3200 (Transfer rates up to 3200 MT/s), Max 64 GB, 2 SO-DIMM
X
X
DDR4-3200 (Transfer rates up to 3200 MT/s), Max 64 GB, 2 U-DIMM
X
X
DDR5-4800 (Transfer rates up to 4800 MT/s), Max 64 GB, 2 U-DIMM
X
X
DDR5-4800 (Transfer rates up to 4800 MT/s) Max 64 GB, 2 SO-DIMM
X
X
DDR5-5600 (Transfer rates up to 5600 MT/s), Max 64 GB, 2 U-DIMM
X
X
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 20
Memory Configuration
Mini
SFF
TWR
AiO
4GB (4GB x 1)
X
X
X
X
8GB (4GB x 2)
X
X
X
X
8GB (8GB x 1)
X
X
X
X
16GB (8GB x 2)
X
X
X
X
16GB (16GB x 1)
X
X
X
X
32GB (16GB x 2)
X
X
X
X
32GB (32GB x 1)
X
X
X
X
64GB (32GB x 2)
X
X
X
X
NOTE: For systems configured with more than 3GB of memory and a 32-bit operating system, all memory may not be available due to system
resource requirements. Addressing memory above 4GB requires a 64-bit operating system.
NOTE: Memory modules support data transfer rates up to 3200 MT/s respectively depending on memory module used; actual data rate is
determined by the system's configured processor. See processor specifications for supported memory data rate.
NOTE: All memory slots are customer accessible / upgradeable.
NOTE: Memory speed 3200 MT/s can be achieved via two UDIMMs per channel (2DPC) when populated with the same part number.
NOTE: Memory modules support data transfer rates up to 5600/MTs requires selected i5, i7 or i9 CPUs. Memory configuration without selected
CPUs support data transfer rates up to 4800 MT/s.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 21
NETWORKING/COMMUNICATIONS
Ethernet (RJ-45)
Mini
SFF
TWR
AiO
Intel® I219-LM 1 Gigabit Network Connection LOM (vPro®)
X
X
X
X
Network Adapter Intel FoxPond1 I225-T1 2.5GbE
X
X
Wireless
Intel® Wi-Fi 6E
2
AX211 + Bluetooth® 5.3 wireless card (802.11AX 2x2
vPro®, supporting gigabit data rate
3
)
4.5
X
X
X
X
Intel® Wi-Fi 6E
2
AX211 + Bluetooth® 5.3 wireless card (802.11AX 2x2
non-vPro®, supporting gigabit data rate
3
)
4,5
X
X
X
X
Realtek Wi-Fi 6
2
RTL8852BE 802.11ax 2x2 with Bluetooth® 5.3 wireless
card
X
X
X
X
Realtek RTL8821CE 802.11ac
5
1x1 with Bluetooth® 4.2 wireless card
X
X
X
X
1. Only available with Intel Core 14
th
Gen processors.
2. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is
backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported. Wi-Fi 6E is designed to support gigabit
data rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports
80MHz and higher channels.
3. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless
router, sold separately, that supports 80MHz and higher channels.
4.The HP 400 G9 TWR/SFF requires Intel ® Core ™ processor with DDR5 memory modules to support Wi-Fi 6E and requires a Wi-Fi 6E router, sold
separately, to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is backwards compatible with prior 802.11
specs. Available in countries where Wi-Fi 6E is supported. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries
where Wi-Fi 6E is supported. For HP 400 G9 TWR/SFF without Intel ® Core ™ processors and DDR5 memory modules, the product does not support
Wi-Fi 6E standard and does not operate under 6GHz band. The products are compatible with 6GHz and other routers, sold separately, which have
capability to operate in 2.4GHz and 5GHz, in compliance with Wi-Fi 6 and prior 802.11 specs. The actual throughput depends on network condition
and router configuration. Internet service required and public wireless access points are limited.
5. Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac)
is backwards compatible with prior 802.11 specs.
NOTE: Usage of the 6GHz band relies on Windows 11 Operating System support.
KEYBOARDS AND POINTING DEVICES
Keyboards
Mini
SFF
TWR
AiO
HP Business Slim PS/2 Wired Keyboard
X
X
HP Wired Desktop 320K Keyboard
X
X
X
X
HP USB Business Slim Wired SmartCard CCID Keyboard
X
X
X
X
HP 125 Wired Keyboard
X
X
X
X
HP 125 Antimicrobial Wired Keyboard (China Only)
X
X
X
X
Keyboard & Mouse Combo
HP 655 Wireless Keyboard and Mouse Combo
X
X
X
X
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 22
Mouse
HP PS/2 Mouse
X
X
HP Wired Desktop 320M Mouse
X
X
X
X
HP 125 Wired Mouse
X
X
X
X
HP 125 Wired Antimicrobial Mouse (China Only)
X
X
X
X
HP 128 Wired Laser Mouse
X
X
X
X
NOTE: Availability may vary by country
SECURITY
Mini
SFF
TWR
AiO
TPM 2.0 (FW: 15.21) endpoint security controller (Infineon
SLB9672/Nuvoton NPCT760HABYX) Common Criteria EAL4+ Certified. FIPS
140-2 Level 2 Certified.
X
X
X
X
Intrusion Sensor (Optional)
X
X
Intrusion Sensor (integrated in the system board, can be enabled/disabled
through BIOS)
X
X
Support for chassis cable lock devices
X
(10 mm
barrel or
smaller)
X
X
X
Support for chassis padlocks devices
X
X
X
Support for table lock
X
SATA port disablement (via BIOS)
X
X
X
Serial, USB enable/disable (via BIOS)
X
X
X
X
Intel® Identify Protection Technology (IPT)
1
X
X
X
X
Removable media write/boot control
X
X
X
X
Power-on password (via BIOS)
X
X
X
X
Setup password (via BIOS)
X
X
X
X
1. Models configured with Intel® Core™ processors have the ability to utilize advanced security protection for online transactions. IPT, used in
conjunction with participating web sites, provides double identity authentication by adding a hardware component in addition to the usual user
name and password. IPT is initialized through an HP Client Security module
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 23
PORTS
Internal Slots and Ports
Mini
SFF
TWR
AiO
M.2 PCIe
(1) M.2 PCIe x1 2230
(for WLAN/BT)
(1) M.2 PCIe x4 2280
(for storage)
(1) M.2 PCIe x1
2230 (for
WLAN/BT
1
)
(1) M.2 PCIe x4
2280 (for storage)
(1) M.2 PCIe x1
2230 (for
WLAN/BT/storage
1
)
(1) M.2 PCIe x4
2280 (for storage)
(1) M.2 PCIe x1
2230 (for WLAN)
(1) M.2 PCIe x4
2280 (for storage)
(1) M.2 PCIe x3
2280 (for storage)
PCI Express v4.0 x1
1
1
PCI Express v4.0 x16
1
1
PCI x1
1
SATA port
2
3
Integrated SATA storage connector
1
1
1. Optional.
NOTE: For Desktop Mini with M.2 Storage config, there will be no SATA drive bracket. If you plan to use or upgrade the storage with any 2.5" SATA
drive, please select a DM SATA Drive Bracket (available as both factory configured and after market option).
NOTE: PCI slots for TWR are full height and SFF are low profile.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 24
Bays
Mini
SFF
TWR
AiO
9.5mm Slim Optical Disc Drive (ODD)
1
1
1
1
SD Card Reader
1
(optional)
1
1
1
2.5" Internal Storage Drive
1
1
3.5" Internal Storage Drive
1
2
1. Must be configured at time of purchase
2. Need to be configured at the time of purchase, either SATA or the ODD can only be selected one at the same time.
Standard User Accessible Ports
Mini
SFF
TWR
AiO
Type-A Hi-Speed USB 480Mbps signaling rate port
2 (rear)
2 (rear)
Type-A SuperSpeed USB 5Gbps signaling rate port
2 (rear)
3 (rear)
3 (rear)
2 (rear)
Type-A SuperSpeed USB 10Gbps signaling rate
port
2 (front)
1 (rear)
3 (front)
3 (front)
2 (rear)
1 (side)
Type-C® SuperSpeed USB 10Gbps signaling rate
port
1 (front)
1 (front)
1 (side)
Type-C® SuperSpeed USB 20Gbps signaling rate
port
1 (front)
Video
2 DisplayPort™
1.4a (rear)
1 HDMI 2.1a (rear)
1 DisplayPort™
1.4a (rear)
1 HDMI 1.4b
(rear)
1 DisplayPort™
1.4a (rear)
1 HDMI 1.4b (rear)
1
DisplayPort™1.4a
1 HDMI-in (Rear)
1.4b
Audio
1 Combo Audio
Jack with CTIA
and headset
support (front)
1 Combo Audio
Jack with CTIA &
OMTP and
headset support
(front)
1 Audio-Line-
in/Line out
(rear)
1 Combo Audio
Jack with CTIA &
OMTP and headset
support (front)
1 Audio-Line-
in/Line out (rear)
1 Combo Audio
Jack with CTIA
and OMTP
headset support
(side)
Network Interface
1 RJ45 (rear)
1 RJ45 (rear)
1 RJ45 (rear)
1 RJ45 (rear)
1. Upgradeable to SuperSpeed USB 10Gbps signaling rate port if configured with additional digital video port via Flex Port 1 and/or Intel® vPro®
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 25
Rear Configurable Non-PCIe/PCI Slot User Accessible Ports
Flexible Port 1, choice of one
of the following:
Mini
SFF
TWR
AiO
Type-A USB
2 Type-A SuperSpeed
USB 5Gbps signaling
rate port
2 Type-A SuperSpeed USB
5Gbps signaling rate port
(rear)
Type-C® USB
1 SuperSpeed USB
10Gbps signaling rate
port w/ DisplayPort™
Alt Mode and power
intake via USB Type-C®
Power Delivery up to
100W
1 SuperSpeed USB
10Gbps signaling rate
port w/ DisplayPort™
Alt Mode
1 SuperSpeed USB 10Gbps
signaling rate port w/
DisplayPort™ Alt Mode
1 SuperSpeed USB
10Gbps signaling rate
port w/ DisplayPort™
Alt Mode
Video
1 DisplayPort™ 1.4a or
HDMI 2.1a or VGA
1 DisplayPort™ 1.4a or
HDMI 2.1a or VGA
1 DisplayPort™ 1.4a or
HDMI 2.1a or VGA
1 DisplayPort™ 1.4a
or
HDMI 2.1a or USB-C
Serial (RS-232)
1
1
1
1
1
1. Sold separately or as an optional feature
(1) Flexible Port 2, choice of
one of the following:
Mini
SFF
TWR
AiO
Type-A USB
2 Hi-Speed USB
480Mbps signaling
rate port
1
1 Type-A SuperSpeed
USB 5Gbps signaling rate
port
2
(front)
Serial (RS-232)
1
1
2
nd
External antenna
1
1
1. Must be configured at time of purchase
2. Front flex IO – Dual USB port and SD card reader can only select one at the same time.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 26
USB SPECIFICATION AND MARKETING NAME MAPPING TABLE
Marketing Name
Technical Terminology
Hi-Speed USB 480Mbps signaling rate
USB 2.0
SuperSpeed USB 5Gbps signaling rate
USB 3.2 Gen 1
SuperSpeed USB 10Gbps signaling rate
USB 3.2 Gen 2
SuperSpeed USB 20Gbps signaling rate
USB 3.2 Gen 2x2
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 27
SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
Software
HP Easy Clean
1
HP PC Hardware Diagnostics UEFI
HP Desktop Support Utilities
HP Privacy Settings
HP Setup Integrated OOBE
HP Support Assistant
2
myHP with Multicamera support (AIO&Mini)
3
HP Notifications
HP Connection Optimizer
HP Smart Support
4
HP Services Scan
5
Microsoft Office
6
Miro
7
Manageability Features
HP Connect
8
HP Image Assistant (download)
HP Manageability Integration Kit (download) (Win 10 Only)
9
HP Client Management Script Library (download)
HP Patch Assistant (download)
10
HP Driver Packs (download)
HP Cloud Recovery
11
HP Client Catalog (download)
Security Features
HP Wolf Security for Business
12
includes HP Sure Click
13
and HP Sure Sense
14
HP Sure Start
15
HP Tamper Lock
16
HP Sure Admin
17
Secured-Core PC (AIO&Mini)
18
Windows Hello Enhanced Sign-in Security (ESS) (AIO)
19
BIOS
HP BIOSphere
20
HP Secure Erase
21
HP DriveLock & Automatic DriveLock
BIOS Update via Network
Absolute Persistence Module
22
Power-On Authentication
23
Microsoft 3rd Party UEFI CA Enable
1. HP Easy Clean requires Windows 10 RS3 and will disable the keyboard, touchscreen, and clickpad only. Ports are not disabled. See user guide for
cleaning instructions.
2. HP Support Assistant is available on Windows. For more information, please visit http://www.support.hp.com/help/hp-support-assistant.
3. MyHP with Multicamera support for Mini Desktop PC will only available on 13
th
processor and beyond.
HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and
health insights and is available preinstalled on select products, thru HP Factory Configuration Services; or it can be downloaded. For more
information about how to enable HP Smart Support or for download, please visit http://www.hp.com/smart-support.
5. HP Services Scan automatically collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and
health insights and is available preinstalled on select products, thru HP Factory Configuration Services; or it can be downloaded. For more
information about how to enable HP Smart Support or for download, please visit http://www.hp.com/smart-support.
6. Microsoft 365 sold separately and requires Internet access for activation.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 28
7. HP customers qualify for a 90 day trail of Miro, this offer ends September 2025. Complete terms and conditions are provided by Miro when
accepting the offer.
8. HP Connect for Microsoft Endpoint Manager is available from the Azure Market Place for HP Pro, Elite, Z and Point-of-Sale PCs managed with
Microsoft Endpoint Manager. Subscription to Microsoft Endpoint Manager required and sold separately. Network connection required.
9. HP Manageability Integration Kit can be downloaded from http://www.hp.com/go/clientmanagement.
10. HP Patch Assistant available on select HP PCs with the HP Manageability Kit that are managed through Microsoft System Center Configuration
Manager. HP Manageability Integration Kit can be downloaded from http://www8.hp.com/us/en/ads/clientmanagement/overview.html.
11. HP Cloud Recovery is available for Z by HP, HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and requires an open,
wired network connection. Note: You must back up important files, data, photos, videos, etc. before use to avoid loss of data. Detail, please refer
to: https://support.hp.com/us-en/document/c05115630.
12. HP Wolf Security for Business requires Windows 10 or 11 Pro or higher, includes various HP security features and is available on HP Pro, Elite,
RPOS and Workstation products. See product details for included security features.
13. HP Sure Click requires Windows 10 Pro or higher or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details.
14. HP Sure Sense is available on select HP PCs with Windows 10 Pro, Windows 10 Enterprise, Windows 11 Pro, or Windows 11 Enterprise OS.
15. HP Sure Start is available on select HP PCs and requires Windows 10 and higher
16. HP Tamper Lock can be Enabled/disabled by customers or IT administrator with administrator authority.
17. HP Sure Admin requires HP G8 or newer platforms, Windows 10 or higher, HP BIOS, HP Manageability Kit or KMS Service from
http://www.hp.com/go/clientmanagement and HP Sure Admin Local Access Authenticator smartphone app from the Android or Apple store
18. Secured-Core PC Enable requires an Intel® vPro®, AMD Ryzen™ Pro processor or Qualcomm® processor with SD850 or higher and requires 8 GB
or more system memory. Secured-core PC is enabled from the factory.
19. Requires a Windows Hello webcam or fingerprint reader.
20. HP BIOSphere features may vary depending on the platform and configuration.
21. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear" sanitation
method. HP Secure Erase does not support platforms with Intel® Optane™.
22. Absolute firmware module is shipped turned off and can only be activated with the purchase a license subscription and full activation of the
software agent. License subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability
outside the U.S. Certain conditions apply. For full details visit: http://www.absolute.com/about/legal/agreements/absolute.
23. Ensures that only authorized users can start up the PC or access the BIOS by requiring user authentication using a password prior to system
start-up.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 29
UNIT ENVIRONMENT AND OPERATING CONDITIONS
General Unit Operating Guidelines
• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit
is operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's
re-circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign
matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.
Temperature Range
Operating: 5° to 35° C
1
Non-Operating for AiO: -20° to 60° C
1
Non-Operating for MT/SFF/DM: -30° to 60° C
1
Relative Humidity
Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Altitude
(unpressurized)
Operating: 5000m
Non-operating: 50000ft (15240 m)
1. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum
rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 30
ENVIRONMENTAL & INDUSTRY
HP Pro Mini 400 G9 Desktop PC
Eco-Label Certifications
& declarations
This product has received or is in the process of being certified to the following approvals and may be
labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT
®
Climate+ registered in the United States. See http://www.epeat.net for registration
status in your country.*
• TCO Certified
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label
• Commission Regulation (EC) No 617/2013 (ErP Lot 3)
NOTE*: Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status
varies by country. Visit http://www.epeat.net for more information.
Sustainable Impact
Specifications
• Ocean-bound plastic in Frame, Panel and Speaker
1
• 40% post-consumer recycled plastic
2
• Low halogen
3
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
4
• Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable
5
• Bulk packaging available
6
System Configuration
The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Desktop model is based on a Typically Configured Desktop.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method)
115VAC, 60Hz
230VAC, 50Hz
100VAC, 60Hz
Normal Operation
(Short idle)
7.23 W
7.31 W
7.07 W
Normal Operation
(Long idle)
2.16 W
2.24 W
2.01 W
Sleep
2.14 W
2.21 W
1.99 W
Off
0.62 W
0.7 W
0.47 W
NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family.
HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental
Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY
STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard
disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation*
115VAC, 60Hz
230VAC, 50Hz
100VAC, 50Hz
Normal Operation
(Short idle)
24.7 BTU/hr
25 BTU/hr
24.2 BTU/hr
Normal Operation
(Long idle)
7.4 BTU/hr
7.7 BTU/hr
6.9 BTU/hr
Sleep
7.3 BTU/hr
7.6 BTU/hr
6.8 BTU/hr
Off
2.1 BTU/hr
2.41 BTU/hr
1.6 BTU/hr
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 31
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one
hour.
Declared Noise
Emissions
(in accordance with
ISO 7779 and ISO 9296)
Sound Power
(L
WAd
, bels)
Sound Pressure
(L
pAm
, decibels)
Typically Configured –
Idle
2.9
17
Fixed Disk – Random
writes
3.0
19
Longevity and upgrading
This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
• 2 SODIMM memory slots
• Interchangeable M.2 PCIe NVME SSD & 2.5” SATA HDD
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries
This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:
Mercury greater than 1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)
Battery type: Lithium
Additional Information
• This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)
Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains a minimum of 35% post-consumer recycled (PCR) plastic (by wt.); including
10% ITE-derived post-consumer recycled plastic.*
• This product is 95.1% recycle-able when properly disposed of at end of life.
*Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard.
Packaging Materials
(vary by country)
External:
PAPER/Paper
562g
Internal:
PAPER/Molded Pulp
79g
PLASTIC/Polyethylene low density - LDPE
16g
Material Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to
the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 32
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage
HP follows these guidelines to decrease the environmental impact of product packaging:
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management
and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP
sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These
instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_
Certificate.pdf and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
Footnotes
1. Percentage of ocean-bound plastic contained in each component varies by product.
2. Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard.
3. External power supplies, WWAN modules, power cords, cables and peripherals excluded.
4. 100% outer box packaging and corrugated cushions made from sustainably sourced certified and recycled
fibers.
5. Fiber cushions made from 100% recycled wood fiber and organic materials.
6. Plastic cushions are made from >90% recycled plastic.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 33
HP Pro SFF 400 G9 Desktop PC
Eco-Label Certifications
& declarations
This product has received or is in the process of being certified to the following approvals and may be
labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEA® Climate+ registered in the United States. See http://www.epeat.net for registration
status in your country.*
• TCO Certified
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label
• Commission Regulation (EC) No 617/2013 (ErP Lot 3)
NOTE*: Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status
varies by country. Visit http://www.epeat.net for more information.
Sustainable Impact
Specifications
• Ocean-bound plastic in Speaker and Fan
• 50% post-consumer recycled plastic
• Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable
• Bulk packaging available
System Configuration
The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Desktop model is based on a Typically Configured Desktop.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method)
115VAC, 60Hz
230VAC, 50Hz
100VAC, 60Hz
Normal Operation
(Short idle)
12.12 W
12.15 W
12.10 W
Normal Operation
(Long idle)
10.38 W
10.41 W
10.35 W
Sleep
0.94 W
0.94 W
0.94 W
Off
0.78 W
0.78 W
0.78 W
NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family.
HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental
Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY
STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard
disk drive, a high efficiency
, and a Microsoft Windows® operating system.
Heat Dissipation*
115VAC, 60Hz
230VAC, 50Hz
100VAC, 60Hz
Normal Operation
(Short idle)
41.34 BTU/hr
41.42 BTU/hr
41.26 BTU/hr
Normal Operation
(Long idle)
35.40 BTU/hr
35.50 BTU/hr
35.28 BTU/hr
Sleep
3.21 BTU/hr
3.20 BTU/hr
3.21 BTU/hr
Off
2.65 BTU/hr
2.64 BTU/hr
2.64 BTU/hr
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 34
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one
hour.
Declared Noise
Emissions
(in accordance with
ISO 7779 and ISO 9296)
Sound Power
(L
WAd
, bels)
Sound Pressure
(L
pAm
, decibels)
Typically Configured –
Idle
3.3
23
Fixed Disk – Random
writes
4.6
36
Optical Drive sequential
reads
3.2
23
Longevity and Upgrading
This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
• 2 DIMM memory slots
• Interchangeable M.2 PCIe NVME SSD & 2.5”/3.5” SATA HDD
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries
This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:
Mercury greater than 1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)
Battery type: Lithium
Additional Information
• This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)
Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains a minimum of 35% post-consumer recycled (PCR) plastic (by wt.); including
10% ITE-derived post-consumer recycled plastic.*
• This product is 92.1% recycle-able when properly disposed of at end of life.
*Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard.
Packaging Materials
(vary by country)
External:
PAPER/Corrugated
1104 g
Internal:
PAPER/Molded pulp
462 g
PLASTIC/Polyethylene low density
26 g
Material Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to
the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 35
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage
HP follows these guidelines to decrease the environmental impact of product packaging:
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management
and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP
sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These
instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
HP Inc. Corporate
Environmental
Information
For more information about HP’s commitment to the environment:
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_
Certificate.pdf and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 36
HP Pro Tower 400/480 G9 PCI Desktop PC
Eco-Label Certifications
& declarations
This product has received or is in the process of being certified to the following approvals and may be
labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT® Climate+ registered in the United States. See http://www.epeat.net for registration
status in your country.*
• TCO Certified
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label
• Commission Regulation (EC) No 617/2013 (ErP Lot 3)
NOTE*: *Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status varies by
country. Visit http://www.epeat.net for more information.
Sustainable Impact
Specifications
• Ocean-bound plastic in Speaker and Fan
• 60% post-consumer recycled plastic
• Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable
• Bulk packaging available
System Configuration
The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Desktop model is based on a Typically Configured Desktop.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method)
115VAC, 60Hz
230VAC, 50Hz
100VAC, 60Hz
Normal Operation
(Short idle)
12.69 W
12.69 W
12.69 W
Normal Operation
(Long idle)
10.95 W
10.97 W
10.95 W
Sleep
0.99 W
0.99 W
0.98 W
Off
0.80 W
0.80 W
0.80 W
NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family.
HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental
Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY
STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard
disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation*
115VAC, 60Hz
230VAC, 50Hz
100VAC, 60Hz
Normal Operation
(Short idle)
43.27 BTU/hr
43.28 BTU/hr
43.26 BTU/hr
Normal Operation
(Long idle)
37.35 BTU/hr
37.40 BTU/hr
37.34 BTU/hr
Sleep
3.36 BTU/hr
3.37 BTU/hr
3.35 BTU/hr
Off
2.72 BTU/hr
2.72 BTU/hr
2.71 BTU/hr
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one
hour.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 37
Declared Noise
Emissions
(in accordance with
ISO 7779 and ISO 9296)
Sound Power
(L
WAd
, bels)
Sound Pressure
(L
pAm
, decibels)
Typically Configured –
Idle
3.1
21
Fixed Disk – Random
writes
3.2
22
Optical Drive - Sequential
reads
4.0
28
Longevity and Upgrading
This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
• 2 DIMM memory slots
• Interchangeable M.2 PCIe NVME SSD & 2.5”/3.5” SATA HDD
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries
This battery(s) in this product complies with EU Directive 2006/66/EC
Batteries used in the product do not contain:
Mercury greater than 1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)
Battery type: Lithium
Additional Information
• This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to complies with the Waste Electrical and Electronic Equipment (WEEE)
Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680.1 (EPEAT) standard at the ® Climate+ level, see
http://www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains 44.4% post-consumer recycled plastic (by wt.)
• This product is 92.1% recycle-able when properly disposed of at end of life.
Packaging Materials
(vary by country)
External:
PAPER/Corrugated
1110 g
PAPER/Molded Pulp
654 g
Internal:
PLASTIC/Polyethylene low density - LDPE
32 g
Material Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to
the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 38
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage
HP follows these guidelines to decrease the environmental impact of product packaging:
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management
and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP
sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These
instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
HP Inc. Corporate
Environmental
Information
For more information about HP’s commitment to the environment:
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_
Certificate.pdf
and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 39
HP ProOne 440 23.8 inch G9 All-in-One Desktop PC
Eco-Label Certifications
& declarations
This product has received or is in the process of being certified to the following approvals and may be labeled
with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT® Climate+ registered in the United States. See http://www.epeat.net for registration status
in your country.
• TCO Certified
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label
• Commission Regulation (EC) No 617/2013 (ErP Lot 3)
Sustainable Impact
Specifications
• Ocean-bound plastic in CPU Fan and Speaker
• 45% post-consumer recycled plastic
• External Power Supply 90% Efficiency
• Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Recycled Plastic cushions
System Configuration
The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is
based on a “Typically Configured Desktop”.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method)
115VAC, 60Hz
230VAC, 50Hz
100VAC, 60Hz
Normal Operation
(Short idle)
16.13 W
16.47 W
16.25 W
Normal Operation
(Long idle)
4.60 W
4.73 W
4.87 W
Sleep
1.75 W
1.76 W
1.73 W
Off
0.67 W
0.62 W
0.62 W
NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family.
HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental
Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY
STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard
disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation*
115VAC, 60Hz
230VAC, 50Hz
100VAC, 60Hz
Normal Operation
(Short idle)
55 BTU/hr
56 BTU/hr
55 BTU/hr
Normal Operation
(Long idle)
15 BTU/hr
16 BTU/hr
17 BTU/hr
Sleep
6 BTU/hr
6 BTU/hr
6 BTU/hr
Off
2 BTU/hr
2 BTU/hr
2 BTU/hr
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one
hour.
Declared Noise
Emissions
Sound Power
(L
WAd
, bels)
Sound Pressure
(L
pAm
, decibels)
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 40
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured –
Idle
2.6
15
Fixed Disk – Random
writes
2.6
16
Optical Drive – Sequential
reads
4.7
35
Longevity and Upgrading
This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
• 2 SODIMM memory slots
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries
This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:
Mercury greater than 1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)
Battery type: Lithium
Additional Information
• This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)
Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard, see http://www.epeat.net.
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains a minimum of 50% post-consumer recycled (PCR) plastic (by wt.); including
10% ITE-derived post-consumer recycled plastic.*
• This product is 95.9% recycle-able when properly disposed of at end of life.
*Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard.
Packaging Materials
(vary by country)
External:
PAPER/Corrugated
2072 g
Paper/Paperboard
1040 g
Internal:
PLASTIC/EPE (Expanded Polyethylene)
182 g
PLASTIC/Polyethylene low density - LDPE
45 g
The plastic packaging material contains at least 0.0% recycled content.
The corrugated paper packaging materials contains at least 90.0% recycled content.
Material Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to
the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 41
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage
HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management
and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP
sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These
instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842 and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
footnotes
• Percentage of ocean-bound plastic contained in each component varies by product
• Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018
standard.
• External power supplies, WWAN modules, power cords, cables and peripherals excluded.
• 100% outer box packaging and corrugated cushions made from sustainably sourced certified and
recycled fibers.
• Plastic cushions are made from >90% recycled plastic.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 42
SERVICE AND SUPPORT
On-site Warranty
1
: One-year (1-1-1) limited warranty delivers one year of on-site, next business day
2
service for parts and
labor support. Service offers terms up to 5 years by choosing an optional HP Care Pack. To choose the right level of service for
your HP product, visit HP Care Pack Central: http://www.hp.com/go/cpc.
3
1. Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in your region.
2. On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider and is not available in
certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
3. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware
purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP services are governed by the applicable HP terms and
conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to
applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided
with your HP Product.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications - Processors
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 43
PROCESSORS
12
th
/13
th
/14
th
Generation Intel® Core™ Processors
1
All HP ProDesk & ProOne 400 Business PC models featuring this technology include processors that are part of the Intel®
Stable Image Platform Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP
ProDesk and ProOne 400 Business PC.
Intel® Advanced Management Technology (AMT)
1
v16 – An advanced set of remote management features and functionality
which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked
client systems regardless of the system's health or power state. AMT 16 includes the following advanced management
functions:
• Support for configuration of Intel® AMT 16.0 capabilities
• No reset after provisioning
• Support for Intel® Enterprise Digital Fence
• The Platform Discovery Utility can now discover these additional Intel® products:
o Intel® Identity Protection Technology with One Time Password
o Public Key Infrastructure
o Multi Factor Authentication
• Profile Editor and Profile Editor Plugin Interface
• Required Permissions for Solutions Framework
1. Intel® Active Management Technology requires an Intel® AMT-enabled chipset, network hardware and software, as well as connection with a
power source and a corporate network connection. Setup requires configuration by the purchaser and may require scripting with the management
console or further integration into existing security frameworks to enable certain functionality. It may also require modifications of
implementation of new business processes.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications - Display Panel Specifications
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 44
DISPLAY PANEL SPECIFICATIONS
NOTE: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either
higher or lower.
HP ProOne 440 23.8 inch G9 All-in-One Desktop PC
23.8" diagonal IPS widescreen WLED backlit anti-glare LCD (1920 x 1080)
Projected Capacitive Touch supports up to 10 touch-points
Support HW low blue light feature
Type
IPS WLED Backlit LCD
Active area (mm)
527.04 x 296.46
Native Resolution (HxV)
1920 x 1080
Refresh Rate
60 Hz @ 1920 x 1080
Aspect ratio
16:9
Pixel pitch (HxV)(mm)
0.2745 x 0.2745
Contrast ratio
1000:1
Brightness*
300nits*
Viewing angle (HxV)
178° x 178°
Backlight lamp life (to half brightness)
30,000 hours minimum
Color support
Up to 16.7 million colors with 8 Bit(6 Bit + FRC)
Color gamut
sRGB 99%
Anti-glare
Yes
Response Time
14ms
Default color temperature
Warm (6500K)
*Actual brightness will be lower with touchscreen
23.8" diagonal IPS widescreen WLED backlit anti-glare LCD (1920 x 1080) non-touch
Support HW low blue light feature
Type
IPS WLED Backlit LCD
Active area (mm)
527.04 x 296.46
Native Resolution (HxV)
1920 x 1080
Refresh Rate
60 Hz @ 1920 x 1080
Aspect ratio
16:9
Pixel pitch (HxV)(mm)
0.2745 x 0.2745
Contrast ratio
1000:1
Brightness*
250nits*
Viewing angle (HxV)
178° x 178°
Backlight lamp life (to half brightness)
30,000 hours minimum
Color support
Up to 16.7 million colors with 8 Bit(6 Bit + FRC)
Color gamut
NTSC 72%
Anti-glare
Yes
Response Time
14ms
Default color temperature
Warm (6500K)
*Actual brightness will be lower with touchscreen
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications - All-in-One Stand Specifications
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 45
ALL-IN-ONE STAND SPECIFICATIONS
HP ProOne 440 23.8 inch G9 All-in-One Desktop PC
Cantilever Stand (Fixed
Height Tilt Stand)
Tilt Angle
-5° to +20°
Rotation (Swivel)
None
Pivot
None
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications - All-in-One Stand Specifications
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 46
Adjustable Height Stand
Height Adjustment (Landscape Mode)
5.12 in / 130mm
Height Adjustment (Portrait Mode)
N/A
Tilt Angle
-5° to +20°
Rotation (Swivel)
±45°
Pivot
None
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications - All-in-One Stand Specifications
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 47
No Stand
(VESA COVER with EPS Holder)
Tilt Angle
None
Rotation (Swivel)
None
Pivot
None
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Graphics
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 48
GRAPHICS
HP Pro Mini 400 G9 Desktop PC
Intel® UHD Graphics (integrated)
Graphics Controller
Integrated
DisplayPort™
Multimode capable; supports HDCP, Display Port Audio , HBR2 link rates and Multi-Stream
Technology for a maximum of 3 displays connected to any output controlled by Intel®
Graphics
HDMI (on board/optional)
Supports HDMI 2.1 features
Supports HDCP 2.3
Supports audio over HDMI
VGA (optional)
VGA output
USB-C® DP Alt Mode(optional)
DisplayPort™ over the USB-C® module
Memory
The actual amount of maximum graphics memory can be >4GB. System memory is allocated
for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide
an optimal balance between graphics and system memory use.
Maximum Color Depth
up to 16 bits/color
Graphics/Video API Support
HEVC 10b Enc/12b Dec HW
VP9 12b Dec HW
HDR
Rec. 2020
DX12
Max. Resolution (HDMI)
4096 x 2160@60Hz
Max. Resolution (DP)
4096 x 2304@60Hz
Max Resolution (optional VGA)
2048 x 1536@60Hz
Max Resolution (optional DP)
5120 x 2160@60Hz
Max Resolution (optional HDMI)
3840 x 2160@60Hz
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Graphics
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 49
HP Pro SFF 400 G9 Desktop PC
Intel® HD Graphics (integrated)
VGA Controller
Integrated
DisplayPort™
Multimode capable; supports HDCP, Display Port Audio, Onboard support HBR2 link
rates/option DP support to HBR3 and Multi-Stream Technology for a maximum of 3 displays
connected to any output controlled by Intel® Graphics
HDMI (onboard / optional)
Supports HDMI 2.1 features (onboard HDMI support HDMI1.4; Option HDMI support HDMI 2.1)
Supports HDCP 2.3 (Support HDCP 1.4/2.3)
Supports audio over HDMI
VGA (optional)
VGA output
USB-C® DP Alt Mode (optional)
DisplayPort™ over the optional USB-C® module (Support DP1.4 HBR2)
Memory
The actual amount of maximum graphics memory can be >4GB. System memory is allocated
for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide
an optimal balance between graphics and system memory use.
Maximum Color Depth
up to 16 bits/color
Graphics/Video API Support
HEVC 10b Enc/12b Dec HW
VP9 12b Dec HW à AV1 decode support 8/10b, 4:2:0
HDR
Rec. 2020
DX12
Max. Resolution (VGA Option)
2048 x 1536@60Hz
Max. Resolution (Onboard HDMI)
1920 x 1080@60Hz
Max. Resolution (Option HDMI)
3840 x 2160@60Hz
Max. Resolution (On board DP)
HBR2: 4096 x 2304@60hz 24 bpp
Max. Resolution (Option DP)
HBR3: 5120 x3200 @60hz 24 bpp
Max. Resolution (Option Type C)
DP HBR2: 4096 x2304 @60hz 24bpp
NVIDIA® Quadro T400 2GB Graphics Card
Engine Clock
2100 MHz
Memory Clock
5001 MHz
Memory Size (width)
2GB (64-bit)
Memory Type
256M x 16 GDDR6
Max. Resolution (DP)
7680x4320@120Hz
Multi Display Support
3 displays
HDCP Compliance
Yes
Rear I/O connectors (bracket)
mDPx3
Cooling (active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption (W)
30W
PCB form-factor with bracket
LP PCB with LP bracket
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Graphics
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 50
NVIDIA® T400 4GB Graphics Card
Engine Clock
2100 MHz
Memory Clock
5001 MHz
Memory Size (width)
4GB (64-bit)
Memory Type
512M x 16 GDDR6
Max. Resolution (DP)
7680x4320@120Hz
Multi Display Support
3 displays
HDCP Compliance
Yes
Rear I/O connectors (bracket)
mDPx3
Cooling (active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption (W)
30W
PCB form-factor with bracket
LP PCB with LP bracket
AMD Radeon™ RX 6300 2GB GDDR6 Graphics card
Engine Clock
Base: 1512 Mhz Boost: 2040 Mhz
Memory Size / Width
2GB / 32bit
Graphic Memory Type / Clock
512Mx32 GDDR6 ,1 pcs / 16Gbps
Max. Resolution (HDMI)
7680x4320@60Hz
Max. Resolution (DP)
7680x4320@120Hz
Multi Display Support
2 displays
HDCP Compliance
Yes
Rear I/O connectors (bracket)
HDMIx1+ DPx1 (LP)
Cooling (active/passive)
Active
Total power consumption (W)
57W
Form-factor
X:160.2mm/Y:68.9mm/Z: 22.6mm PCB with single slot
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Graphics
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 51
HP Pro Tower 400 G9 Desktop PC
Intel® HD Graphics (integrated)
VGA Controller
Integrated
DisplayPort™
Multimode capable; supports HDCP, Display Port Audio, Onboard support HBR2 link
rates/option DP support to HBR3 and Multi-Stream Technology for a maximum of 3 displays
connected to any output controlled by Intel® Graphics
HDMI (onboard / optional)
Supports HDMI 2.1 features (onboard HDMI support HDMI1.4; Option HDMI support HDMI 2.1)
Supports HDCP 2.3 (Support HDCP 1.4/2.3)
Supports audio over HDMI
VGA (optional)
VGA output
USB-C® DP Alt Mode (optional)
DisplayPort™ over the optional USB-C® module (Support DP1.4 HBR2)
Memory
The actual amount of maximum graphics memory can be >4GB. System memory is allocated
for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide
an optimal balance between graphics and system memory use.
Maximum Color Depth
up to 16 bits/color
Graphics/Video API Support
HEVC 10b Enc/12b Dec HW
VP9 12b Dec HW à AV1 decode support 8/10b, 4:2:0
HDR
Rec. 2020
DX12
Max. Resolution (VGA Option)
2048 x 1536@60Hz
Max. Resolution (Onboard HDMI)
1920 x 1080@60Hz
Max. Resolution (Option HDMI)
3840 x 2160@60Hz
Max. Resolution (On board DP)
HBR2: 4096 x 2304@60hz 24 bpp
Max. Resolution (Option DP)
HBR3: 5120 x3200 @60hz 24 bpp
Max. Resolution (Option Type C)
DP HBR2: 4096 x2304 @60hz 24bpp
NVIDIA® Quadro T400 2GB Graphics Card
Engine Clock
2100 MHz
Memory Clock
5001 MHz
Memory Size (width)
2GB (64-bit)
Memory Type
256M x 16 GDDR6
Max. Resolution (DP)
7680x4320@120Hz
Multi Display Support
3 displays
HDCP Compliance
Yes
Rear I/O connectors (bracket)
mDPx3
Cooling (active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption (W)
30W
PCB form-factor with bracket
LP PCB with LP bracket
NVIDIA® T400 4GB Graphics Card
Engine Clock
2100 MHz
Memory Clock
5001 MHz
Memory Size (width)
4GB (64-bit)
Memory Type
512M x 16 GDDR6
Max. Resolution (DP)
7680x4320@120Hz
Multi Display Support
3 displays
HDCP Compliance
Yes
Rear I/O connectors (bracket)
mDPx3
Cooling (active/passive)
Active fan-sink (Active cooling with dynamic speed)
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Graphics
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 52
Total power consumption (W)
30W
PCB form-factor with bracket
LP PCB with LP bracket
NVIDIA® GeForce® RTX 3050 8GB GDDR6 Graphics Card
Engine Clock
Base: 1515 Mhz Boost: 1755 Mhz
Frame Buffer Size / Width
8GB/128bit
Graphic Memory Type / Clock
512Mx32 GDDR6 @ 4 pcs/14Gbps
Max. Resolution (HDMI)
7680x4320@60Hz
Max. Resolution (DP)
7680x4320@60Hz
Multi Display Support
4 displays
HDCP Compliance
Yes
Rear I/O connectors (bracket)
HDMIx1+ DPx3
Cooling (active/passive)
Active fansink with 4 pin fan control
Total power consumption (W)
120W
Form-factor
ATX (X:144.7mm/Y:111.15mm/Z: 36.70mm) PCB with ATX dual slot bracket
NOTE: PCIe 2x4 power connector requires for RTX3050 with 400W PSU
Intel® Arc™ A380 6GB GDDR6 Graphics card
4
Engine Clock
2150Mhz
Frame Buffer Size / Width
6GB/96bit
Graphic Memory Type / Clock
GDDR6 ,3 pcs/15.5Gbps
Max. Resolution (HDMI)
4096 x2160@60Hz
Max. Resolution (DP)
7680x4320@60Hz
Multi Display Support
4 displays
HDCP Compliance
Yes
Rear I/O connectors (bracket)
DP x3 + HDMI x1
Cooling (active/passive)
Active
Total power consumption (W)
75W
AMD Radeon™ RX 6300 2GB GDDR6 Graphics card
Engine Clock
Base: 1512 Mhz Boost: 2040 Mhz
Memory Size / Width
2GB / 32bit
Graphic Memory Type / Clock
512Mx32 GDDR6 ,1 pcs / 16Gbps
Max. Resolution (HDMI)
7680x4320@60Hz
Max. Resolution (DP)
7680x4320@120Hz
Multi Display Support
2 displays
HDCP Compliance
Yes
Rear I/O connectors (bracket)
HDMIx1+ DPx1 (LP)
Cooling (active/passive)
Active
Total power consumption (W)
57W
Form-factor
X:160.2mm/Y:68.9mm/Z: 22.6mm PCB with single slot
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Graphics
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 53
HP PROONE 440 23.8 INCH G9 ALL-IN-ONE DESKTOP PC
Intel® UHD Graphics (integrated)
Graphics Controller
Integrated
DisplayPort™
Multimode capable; supports HDCP, Display Port Audio , HBR2 link rates and Multi-Stream
Technology for a maximum of 3 displays connected to any output controlled by Intel®
Graphics
HDMI (onboard / optional)
Supports HDMI 2.1 features
Supports HDCP 2.3
Supports audio over HDMI
USB-C® DP Alt Mode (optional)
DisplayPort™ over the USB-C® module
Memory
The actual amount of maximum graphics memory can be >4GB. System memory is allocated
for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide
an optimal balance between graphics and system memory use.
Maximum Color Depth
up to 16 bits/color
Graphics/Video API Support
HEVC 10b Enc/12b Dec HW
VP9 12b Dec HW
HDR
Rec. 2020
DX12
Max. Resolution (HDMI)
4096 x 2160@60Hz
Max. Resolution (DP)
4096 x 2304@60Hz
Max. Resolution (Optional VGA)
2048 x 1536@60Hz
Max. Resolution (Optional DP)
5120 x 2160@60Hz
Max. Resolution (Optional HDMI)
3840 x 2160@60Hz
AMD Radeon™ RX 6300 2GB GDDR6 Graphics card
Engine Clock
Base: 1512 Mhz Boost: 2040 Mhz
Memory Size / Width
2GB / 32bit
Graphic Memory Type / Clock
512Mx32 GDDR6 ,1 pcs / 16Gbps
HDCP Compliance
Yes
Total power consumption (W)
25W
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Storage
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 54
STORAGE
NOTE: Starting from November 1
st
, 2023, all shipments will require Windows to be installed when selecting a SSD.
HDD can only be configured as additional data drives and not as the boot drive.
1TB 7200RPM 3.5in SATA HDD
Capacity
1TB
Rotational Speed
7,200 rpm
Interface
SATA 6 Gb/s
Buffer Size
64MB
Logical Blocks
1,953,525,168
Seek Time
11 ms (Average)
Height
1in/2.54cm
Width (nominal)
Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
2TB 7200RPM 3.5in SATA HDD
Capacity
2TB
Rotational Speed
7,200 rpm
Interface
SATA 6 Gb/s
Buffer Size
128MB
Logical Blocks
3,907,050,336
Seek Time
11 ms (Average)
Height
1.028in/26.11mm
Width (nominal)
Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
1TB 7200RPM 2.5in SATA HDD
Capacity
1TB
Rotational Speed
7,200 rpm
Interface
SATA 6 Gb/s
Buffer Size
Up to 128MB
Logical Blocks
1,953,525,168
Seek Time
12 ms (Average)
Height
0.283 in/7.2 mm (Max)
Width (nominal)
2.75 in/70 mm (nominal)
Operating Temperature
41° to 131° F (5° to 55° C)
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Storage
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 55
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
256GB M.2 2280 PCIe NVMe SSD
Capacity
256GB
Interface
PCIe NVMe
Minimum Sequential Read
2000 MB/s ±10%
Minimum Sequential Write
900 MB/s ±10%
Logical Blocks
500,118,192
Features
TRIM; L1.2
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
512GB M.2 2280 PCIe NVMe SSD
Capacity
512GB
Interface
PCIe NVMe
Minimum Sequential Read
2200 MB/s ±10%
Minimum Sequential Write
1000 MB/s ±10%
Logical Blocks
1,000,215,216
Features
TRIM; L1.2
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
1TB M.2 2280 PCIe NVMe SSD
Capacity
1TB
Interface
PCIe NVMe
Minimum Sequential Read
2200 MB/s ±10%
Minimum Sequential Write
1600 MB/s ±10%
Logical Blocks
2,000,409,264
Features
TRIM; L1.2
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
256GB M.2 2280 PCIe NVMe Three Layer Cell SSD
Capacity
256GB
Interface
PCIE Gen4x4
Minimum Sequential Read
4000 MB/s ±10%
Minimum Sequential Write
2000 MB/s ±10%
Logical Blocks
500,118,192
Features
TRIM; L1.2; Pyrite 2.0
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Storage
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 56
512GB M.2 2280 PCIe NVMe Three Layer Cell SSD
Capacity
512GB
Interface
PCIE Gen4x4
Minimum Sequential Read
6400 MB/s ±10%
Minimum Sequential Write
3500 MB/s ±10%
Logical Blocks
1,000,215,216
Features
TRIM; L1.2; Pyrite 2.0
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
1TB M.2 2280 PCIe NVMe Three Layer Cell SSD
Capacity
1TB
Interface
PCIE Gen4x4
Minimum Sequential Read
6400 MB/s ±10%
Minimum Sequential Write
5000 MB/s ±10%
Logical Blocks
2,000,409,264
Features
TRIM; L1.2; Pyrite 2.0
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
2TB M.2 2280 PCIe NVMe Three Layer Cell SSD
Capacity
2TB
Interface
PCIE Gen4x4
Minimum Sequential Read
6400 MB/s ±10%
Minimum Sequential Write
5000 MB/s ±10%
Logical Blocks
4,000,797,360
Features
TRIM; L1.2; Pyrite 2.0
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Value SSD
Capacity
256GB
Interface
PCIE NVMe
Minimum Sequential Read
2000 MB/s ±10%
Minimum Sequential Write
900 MB/s ±10%
Logical Blocks
500,118,192
Features
Pyrite 2.0; TRIM; L1.2
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Storage
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 57
256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Capacity
256GB
Interface
PCIE Gen4x4
Minimum Sequential Read
4000 MB/s ±10%
Minimum Sequential Write
2000 MB/s ±10%
Logical Blocks
500,118,192
Features
TRIM; L1.2; TCG Opal 2.0
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
512GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Capacity
512GB
Interface
PCIE Gen4x4
Minimum Sequential Read
6400 MB/s ±10%
Minimum Sequential Write
3500 MB/s ±10%
Logical Blocks
1,000,215,216
Features
TRIM; L1.2; TCG Opal 2.0
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
HP 9.5mm Slim DVD-ROM Drive
Height
9.5 mm height
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Dimensions (W x H x D)
5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max)
Up to 0.31 lb (140g) without bezel
Read Speeds
DVD+R/-R/+RW/
-RW/+R DL /-R DL Up to 8X
DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Access time
(typical reads, including
settling)
Random: DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
Full stroke: DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
Power
Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions
(operating - non-condensing)
Temperature 41° to 122° F (5° to 50° C)
Relative Humidity 10% to 80%
Maximum Wet Bulb Temperature 84° F (29° C)
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Storage
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 58
HP 9.5mm Slim DVD Writer Drive
Height
9.5 mm height
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Dimensions (W x H x D)
5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max)
Up to 0.31 lb (140 g) Without bezel
Write Speeds
DVD-R DL - Up to 6X
DVD+R - Up to 8X
DVD+RW - Up to 8X
DVD+R DL - Up to 6X
DVD-R - Up to 8X
DVD-RW - Up to 6X
CD-R - Up to 24X
CD-RW - Up to 10X
Read Speeds
DVD-RW, DVD+RW - Up to 8X
DVD-R DL, DVD+R DL - Up to 8X
DVD+R, DVD-R - Up to 8X
DVD-ROM DL, DVD-ROM - Up to 8X
CD-ROM, CD-R - Up to 24X
CD-RW - Up to 24X
Access time
(typical reads, including
settling)
Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
Stop Time 6 seconds (typical)
Power
Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions
(operating - non-condensing)
Temperature 41° to 122° F (5° to 50° C)
Relative Humidity 10% to 80%
Maximum Wet Bulb Temperature 84° F (29° C)
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 59
NETWORKING AND COMMUNICATIONS
Intel® I219-LM 1 Gigabit Network Connection LOM (vPro®)
Connector
RJ-45
System Interface
PCI (Intel® proprietary) + SMBus
Data rates supported
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE Compliance
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance
TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
Power consumption
Cable Disconnection: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000mW
WoL Enable (S3/S4/S5): 50mW
WoL Disable (S3/S4/S5): 25mW
Power
Management
ACPI compliant – multiple power modes
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Management Interface
Auto MDI/MDIX Crossover cable detection
IT Manageability
Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up
Frame); Wake-on-LAN from off (Magic Packet only), Microsoft Windows Fast Startup must
be disabled.
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Manageability
Intel® vPro® support with appropriate Intel® chipset components
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 60
Network Adapter Intel FoxPond1 I225-T1 2.5GbE
Connector
RJ-45
System Interface
PCI (Intel® proprietary) + SMBus
Data rates supported
1. 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
2. 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
3. 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses 40)
4. 2.5 Gbit/s operation (2.5GBASE-T; IEEE 802.3bz Clause 126)
5. Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10, 100 & 1000 Mbit/s
IEEE Compliance
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
IEEE 802.3i 10BASE-T
IEEE 802.3u 100BASE-TX
IEEE 802.3ab 1000BAE-T
IEEE 802.3bz 2.5GBASE-T
Performance
TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
Power consumption
Cable Disconnection: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000mW
WoL Enable (S3/S4/S5): 50mW
WoL Disable (S3/S4/S5): 25mW
Power
Management
ACPI compliant – multiple power modes
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Management Interface
Auto MDI/MDIX Crossover cable detection
IT Manageability
Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up Frame);
Wake-on-LAN from off (Magic Packet only), Microsoft Windows Fast Startup must be disabled.
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 61
Intel I226-T1 2.5GbE Ethernet Network Adapter
Connector
RJ-45
System Interface
PCI (Intel proprietary) + SMBus
Data rates supported
1. 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
2. 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
3. 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses 40)
4. 2.5 Gbit/s operation (2.5GBASE-T; IEEE 802.3bz Clause 126)
5. Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 & 100 Mbit/s
IEEE Compliance
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
IEEE 802.3i 10BASE-T
IEEE 802.3u 100BASE-TX
IEEE 802.3ab 1000BAE-T
IEEE 802.3bz 2.5GBASE-T
Performance
TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling(Hash Mode Only)
Jumbo Frame 9K
Power consumption
Cable Disconnection: 25mW
100Mbps Full Run: 450mW
1000Mbp Full Run: 1000mW
2500Mbp Full Run: 4500mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power
ACPI compliant – multiple power modes
Management
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Management Interface
Auto MDI/MDIX Crossover cable detection
IT Manageability
Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up
Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 62
Realtek 802.11a/b/g/n/ac (1x1) Wi Fi® and Bluetooth® 4.2 wireless card
1
Wireless LAN Standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability
Wi-Fi® certified modules
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n/ac
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 150Mbps
• 802.11ac: max 433.3Mbps
Modulation
Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security
2
• IEEE and Wi-Fi® certified 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• WPA3 certification
• IEEE 802.11i
• WAPI
Network Architecture
Models
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power
3
• 802.11b: +14dBm minimum
• 802.11g: +12dBm minimum
• 802.11a: +12dBm minimum
• 802.11n HT20(2.4GHz): +12dBm minimum
• 802.11n HT40(2.4GHz): +12dBm minimum
• 802.11n HT20(5GHz): +10dBm minimum
• 802.11n HT40(5GHz): +10dBm minimum
• 802.11ac VHT80(5GHz): +10dBm minimum
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 63
Power Consumption
• Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity
4
802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
Antenna type
High efficiency antenna.
One embedded dual band 2.4/5 GHz antenna is provided to the card to support WLAN
communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230: 2.3 x 22.0 x 30.0 mm
Weight
Type 2230: 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF;
LED OFF – Radio ON
HP Integrated Module with Bluetooth® 4.0/4.1/4.2 wireless card Technology
Bluetooth
®
Specification
4.0/4.1/4.2 wireless card Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH)
BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5)
or 864 kbps symmetric (3-EV5)
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of + 4 dBm for BR and EDR.
Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Transmit Power
USB 2.0 compliant
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 64
Power Consumption
Microsoft Windows Bluetooth Software
Bluetooth
®
Software Supported
Link Topology
Microsoft Windows ACPI, and USB Bus Support
Power Management
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications
4.0/4.1/4.2 Compliant
Power Management
Certifications
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth® Profiles Supported
BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
1. Wi-Fi 5 is designed to support gigabit data rate when transferring files between two devices connected to the same router.
Requires a wireless router, sold separately, that supports 80MHz and higher channels. Wireless access point and internet service
required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac) is backwards compatible with
prior 802.11 specs.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 65
Realtek RTL8852BE 802.11ax 2x2 Wi-Fi® + Bluetooth® 5.3 wireless card (802.11ax 2x2, supporting gigabit data
rate)
1
Wireless LAN Standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability
Wi-Fi® certified modules
Frequency Band
802.11b/g/n/ax
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: max 866.7Mbps
• 802.11ax: max 1201Mbps
Modulation
Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security
2
• IEEE and Wi-Fi® certified 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• WPA3 certification
• IEEE 802.11i
• WAPI
Network Architecture
Models
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power
3
• 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT40(2.4GHz): +14.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11n HT40(5GHz): +14.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 66
• 802.11ax HE40(2.4GHz): +10dBm minimum
• 802.11ax HE80(5GHz): +10dBm minimum
Power Consumption
• Transmit mode:2.5 W
• Receive mode:2 W
• Idle mode (PSP): 180 mW (WLAN Associated)
• Idle mode:50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity
4
802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
•802.11ax, MCS11(HE40): -57dBm maximum
•802.11ax, MCS11(HE80): -54dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN
MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight
1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating Voltage
3.3v +/- 9%
Temperature
Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF;
LED OFF – Radio ON
HP Integrated Module with Bluetooth® 4.0/4.1/4.2/5.0/5.1/5.2/5.3 wireless card Technology
Bluetooth
®
Specification
4.0/4.1/4.2/5.0/5.1/5.2 /5.3 wireless card Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH)
BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 67
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of + 4 dBm for BR and EDR.
Power Consumption
Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Electrical Interface
Microsoft Windows Bluetooth Software
Bluetooth
®
Software Supported
Link Topology
Microsoft Windows ACPI, and USB Bus Support
Power Management
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
UL, CSA, and CE Mark
Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Power Management
Certifications
Microsoft Windows Bluetooth Software
Bluetooth® Profiles Supported
BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.1
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
1. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless
router, sold separately, that supports 80MHz and higher channels.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must
fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM
modulation).
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 68
Intel® AX211 Wi-Fi 6E +Bluetooth® 5.3 wireless card M.2 160MHz CNVi WW WLAN
1
Wireless LAN Standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n/ax
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
• 5.955 – 6.415 GHz
• 6.435 – 6.515 GHz
• 6.535 – 6.875 GHz
• 6.895 – 7.115 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: 1733Mbps
• 802.11ax: max 2.4Gbps
Modulation
Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
, 1024QAM
Security
2
• IEEE and Wi-Fi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• WPA3 certification
• IEEE 802.11i
• WAPI
Network Architecture
Models
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power
3
• 802.11b: +17dBm minimum
• 802.11g: +16dBm minimum
• 802.11a: +17dBm minimum
• 802.11n HT20(2.4GHz): +14dBm minimum
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 69
• 802.11n HT40(2.4GHz): +13dBm minimum
• 802.11n HT20(5GHz): +14dBm minimum
• 802.11n HT40(5GHz): +13dBm minimum
• 802.11ac VHT80(5GHz): +10dBm minimum
• 802.11ac VHT160(5GHz): +10dBm minimum
• 802.11ax HE40(2.4GHz): +12dBm minimum
• 802.11ax HE80(5GHz): +10dBm minimum
• 802.11ax HE160(5GHz): +10dBm minimum
Power Consumption
• Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity
4
•802.11b, 1Mbps: -93.5dBm maximum
•802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11a/g, 54Mbps: -72dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11n, MCS15: -64dBm maximum
• 802.11ac, MCS0(VHT80): -84dBm maximum
• 802.11ac, MCS9(VHT80): -59dBm maximum
• 802.11ac, MCS9(VHT160): -58.5dBm maximum
•802.11ax, MCS11(HE40): -57dBm maximum
•802.11ax, MCS11(HE80): -54dBm maximum
•802.11ax, MCS11(HE160): -53.5dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5/6 GHz antennas are provided to the card to support WLAN
MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight
1. Type 2230: 2.8g
2. Type 1216: 1.3g
Operating Voltage
3.3v +/- 9%
Temperature
Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED OFF – Radio ON
HP Integrated Module with Bluetooth® 4.0/4.1/4.2/5.0/5.1/5.2/5.3 wireless card Technology
Bluetooth
®
Specification
4.0/4.1/4.2/5.0/5.1/5.2 5.3 wireless card Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH)
BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 70
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5)
or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of + 9.5 dBm for BR and EDR.
Power Consumption
Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth
®
Software Supported
Link Topology
Microsoft Windows Bluetooth Software
Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management
Certifications
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth® Profiles Supported
BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.2
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
1. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is
backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported. Wi-Fi 6E is designed to support gigabit data
rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports 80MHz
and higher channels.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must
fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM
modulation).
5. Usage of the 6GHz band relies on Windows 11 Operating System support.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 71
Intel® AX211 Wi-Fi 6E + Bluetooth® 5.3 wireless card M.2 vPro® 160MHz CNVi WW WLAN
1
Wireless LAN Standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability
Wi-Fi certified
Frequency Band
802.11b/g/n/ax
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
• 5.955 – 6.415 GHz
• 6.435 – 6.515 GHz
• 6.535 – 6.875 GHz
• 6.895 – 7.115 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: 1733Mbps
• 802.11ax: max 2.4Gbps
Modulation
Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
, 1024QAM
Security
2
• IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• WPA3 certification
• IEEE 802.11i
• WAPI
Network Architecture
Models
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power
3
• 802.11b: +17dBm minimum
• 802.11g: +16dBm minimum
• 802.11a: +17dBm minimum
• 802.11n HT20(2.4GHz): +14dBm minimum
• 802.11n HT40(2.4GHz): +13dBm minimum
• 802.11n HT20(5GHz): +14dBm minimum
• 802.11n HT40(5GHz): +13dBm minimum
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 72
• 802.11ac VHT80(5GHz): +10dBm minimum
• 802.11ac VHT160(5GHz): +10dBm minimum
• 802.11ax HE40(2.4GHz): +12dBm minimum
• 802.11ax HE80(5GHz): +10dBm minimum
• 802.11ax HE160(5GHz): +10dBm minimum
Power Consumption
• Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity
4
•802.11b, 1Mbps: -93.5dBm maximum
•802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11a/g, 54Mbps: -72dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11n, MCS15: -64dBm maximum
• 802.11ac, MCS0(VHT80): -84dBm maximum
• 802.11ac, MCS9(VHT80): -59dBm maximum
• 802.11ac, MCS9(VHT160): -58.5dBm maximum
•802.11ax, MCS11(HE40): -57dBm maximum
•802.11ax, MCS11(HE80): -54dBm maximum
•802.11ax, MCS11(HE160): -53.5dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5/6 GHz antennas are provided to the card to support WLAN
MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight
1. Type 2230: 2.8g
2. Type 1216: 1.3g
Operating Voltage
3.3v +/- 9%
Temperature
Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED OFF – Radio ON
HP Integrated Module with Bluetooth® 4.0/4.1/4.2/5.0/5.1/5.2 /5.3 wireless card Technology
Bluetooth
®
Specification
4.0/4.1/4.2/5.0/5.1/5.2/5.3 wireless card Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH)
BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Networking
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 73
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of + 9.5 dBm for BR and EDR.
Power Consumption
Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth
®
Software Supported
Link Topology
Microsoft Windows Bluetooth Software
Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management
Certifications
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth® Profiles Supported
BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.2
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
1. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is
backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported. Wi-Fi 6E is designed to support gigabit data
rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports 80MHz
and higher channels.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must
fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM
modulation).
5. Usage of the 6GHz band relies on Windows 11 Operating System support.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 74
I/O DEVICES
HP Business Slim Standalone USB/PS2 Wired Keyboard
Physical Characteristics
Keys
104, 105, 106, 107, 109 layout (depending upon country)
Dimensions
(L x W x H)
171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±
1.0 cm)
Weight
1.32 lb (0.6± 0.08 kg)
Electrical
Operating voltage
4.4-5.25VDC
Power consumption
50-mA maximum (with 5 VDC power supplied and three
LEDs ON)/
System interface
USB or PS/2
ESD
Contact Discharge: 2, 4,6,8KV
Air Discharge: 2, 4, 8,10,12.5KV
EMI – RFI
Conforms to FCC rules for a Class B computing device
Mechanical
Keycaps
Low-profile design
Switch actuation
60±12.5g nominal peak force with tactile feedback
Switch life
10 million keystrokes (Life tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
6 ft (1.8 m)
Environmental
Acoustics
43-dBA maximum sound pressure level
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
Minus 30 degress to 60 degress Celsius
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Drop (out of box)
26 in (66 cm) on carpet, six-drop sequence
Drop (in box)
30 in (76.2 cm) on concrete, 16-drop sequence
Approvals
UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC
Ergonomic compliance
ANSI HFS 100, ISO 9241-4, and TUVGS
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 75
HP USB Business Slim Wired SmartCard CCID Keyboard
Physical Characteristics
Keys
104, 105, 107, 109 layout (depending upon country)
Dimensions
(L x W x H)
17.34 x 5.68 x 0.78in (440.6 x 144.5 x 1.98 cm)
Weight
1.32 lb (598g)
Electrical
Operating voltage
5 VDC, +/-5%
Power consumption
100mA (All LED on)
System interface
USB Type A plug connector
ESD
Contact Discharge: 8 KV Air Discharge: 12.5 KV
EMI - RFI
Conforms to FCC rules for a Class B computing device
Mechanical
Keycaps
Low-profile design
Switch actuation
60±10g nominal peak force with tactile feedback
Switch life
10 million keystrokes (Life tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
6 ft (1.8 m)
Environmental
Acoustics
43-dBA maximum sound pressure level
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
-22° to 140° F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Drop (out of box)
26 in (66 cm) on carpet, six-drop sequence
Drop (in box)
30 in (76.2 cm) on concrete, 16-drop sequence
Approvals
CE Marking, TUV, EAC, FCC, cULus/CSAus, ICES, RCM, VCCI, KCC, BSMI
Ergonomic compliance
ISO 9241-4, TUVGS
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 76
HP 125 (AntiMicrobial) Wired Keyboard (China only)
Physical Characteristics
Keys
104/105/107/109layout (depending upon country)
Dimensions
(L x W x H)
436 x 138 x24.7 mm
Weight
471g
Electrical
Operating voltage
5V +- 5%
Power consumption
50mA
System interface
USB Type A plug connector
ESD
Contact Discharge: 8 KV Air Discharge: 12.5 KV
EMI - RFI
Conforms to FCC rules for a Class B computing device
Mechanical
Keycaps
Low-profile design
Switch actuation
55±10g nominal peak force with tactile feedback
Switch life
10 million keystrokes (Life tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
1.8 m
Environmental
Acoustics
43-dBA maximum sound pressure level
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
-4° to 149° F (-20° to 65° C)
Operating humidity
10% to 95% (non-condensing at ambient)
Non-operating humidity
0% to 95% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Drop (out of box)
26 in (66 cm) on carpet, six-drop sequence
Drop (in box)
30 in (76.2 cm) on concrete, 16-drop sequence
Approvals
UL, cUL, FCC, CE, TUV GS, VCCI, BSMI, RCM, KCC, USB-IF, WHQL, EN/IEC 60601-1
Ergonomic compliance
ANSI HFS 100, ISO 9241-4, and TUVGS
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 77
HP 655 wireless Keyboard
Physical Characteristics
Keys
104, 105, 107,109 layouts
Dimensions
(L x W x H)
16.86 x 4.55 x 0.71 in (428.22 x 115.47 x 18.06 mm)
Weight
0.96 lb (435g)
Electrical
Operating voltage
3 VDC, +/-5%
Power consumption
20 mA Max (All LED on)
System interface
2.4GHz Wireless
ESD
Contact Discharge: 8 KV Air Discharge: 15 KV
EMI - RFI
Conforms to FCC rules for a Class B computing device
Mechanical
Keycaps
Plunger, 2.0 mm key travel
Key actuation
60±10g nominal peak force with tactile feedback
Key life
10 million keystrokes (Life tester)
Key structure type
Rubber dome & Membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Environmental
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
-22° to 140° F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Drop (out of box)
26 in (66 cm) on carpet, six-drop sequence
Drop (in box)
30 in (76.2 cm) on concrete, 16-drop sequence
Approvals
CB, CE, FCC, cULus, ICES, IC, I TRC, TRA, CASA, UA, EAC, CNC, ANATEL, NOM-NYCE SCT, IFETEL,
MPTC, RCM, BIS, PosTel, VCCI, TELEC, KC, MCMC, IDA, BSMI, NCC, DWLF&M, TP-BY, MOC
Ergonomic compliance
TUVGS
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 78
HP Wired Desktop 320K Keyboard
Physical Characteristics
Keys
104, 105, 107,109 layouts
Dimensions(L x W x H)
18.86*4.55*0.66 in (426.2 x 110.9 x 16.7 mm)
Weight
1.00 lb(452g)
Electrical
Operating voltage
5 VDC, +/-5%
Power consumption
50 mA Max (All LED on)
System interface
USB Port
ESD
Contact Discharge: 8 KV Air Discharge: 15 KV (Class B)
EMI - RFI
European Standard EN 55022: 2006+A1: 2007, Class B.
FCC/CFR 47 : Part 15 Class B
Mechanical
Keycaps
2.0mm +/-0.2mm at 120gf Key travel
Environmental
Operating temperature
10° C to 90° C
Non-operating temperature
-30° C to 95° C
Operating humidity
N/A
Non-operating humidity
10% to 90% (non-condensing at ambient)
Operating shock
N/A
Non-operating shock
i. Half-Sine Shock – End-Use Handling, Non-Operational
Sample size: 5pcs.
Condition: Sample power off.
Axis: X, Y, Z axis (all 6 faces) – sample normal mode of
operation.
Number of shocks: 1 shock/face.
Pulse duration: < 3 ms
Velocity change: 50lps (inch-per-second)- 65lps desired.
ii. Trapezoidal Shock- Transportation Environment, Non-
Operational
Sample size: 5pcs.
Condition: Sample power off.
Orientation: All six faces: Front, Rear, Left, Right, Bottom, and
Top.
Configuration: As intended for shipment
Number of shocks: 1 shock/face.
Minimum faired acceleration: 30G’s. Test also at 40 and 50G’s
to find margin.
Velocity change: 266lps (inch-per-second) for product mass (m)
20<m<40lb.
Operating vibration
Frequency
(Hz)
Slope (dB/oct)
PSD (g
2
/Hz)
5-350
0
0.0001
350-500
-6
-
500
-
0.00005
(~0.21G
nms
)
Total Test time: 10 minutes
Non-operating vibration
Frequency
(Hz)
Slope (dB/oct)
PSD (g
2
/Hz)
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
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Page 79
5.100
0
0.015
100-137
-6
-
137-350
0
0.008
350-500
-6
-
500
-
0.0039
Drop (out of box)
76cm on carpet, six-drop sequence
Drop (in box)
10 times drop including 6 faces, one corner and 3 edges on rigid
surface.
Drop Height: 91cm
Approvals
CB, CE, FCC, ICES, EAC, NOM-NYCE SCT, RCM, BIS, VCCI, KC, BSMI
Ergonomic compliance
TUVGS
HP Wired Desktop 320M Mouse
Physical Characteristics
Keys
Left/right key
Dimensions(L x W x H)
4.09 x2.50 x 1.40 in (103.8x 63.4 x 35.5 mm)
Weight
0.16 lb(72g)
Electrical
Operating voltage
5 VDC, +/-0.25V
Power consumption
100 mA Max
System interface
USB Port
ESD
Contact Discharge: 8 KV Air Discharge: 15 KV (Class B)
EMI - RFI
European Standard EN 55022: 2006+A1: 2007, Class B.
FCC/CFR 47 : Part 15 Class B
Mechanical
Keycaps
0.3mm key travel
Key actuation
75±20g
Key life
1million cycles
Key structure type
Tact Switch
Key-leveling mechanisms
N/A
Environmental
Operating temperature
10° to 90° C
Non-operating temperature
-30° C to 95° C
Operating humidity
N/A
Non-operating humidity
10% to 90% (non-condensing at ambient)
Operating shock
N/A
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
Not all configuration components are available in all regions/countries.
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Page 80
Non-operating shock
i. Half-Sine Shock – End-Use Handling, Non-Operational
Sample size: 5pcs.
Condition: Sample power off.
Axis: X, Y, Z axis (all 6 faces) – sample normal mode of
operation.
Number of shocks: 1 shock/face.
Pulse duration: < 3 ms
Velocity change: 50lps (inch-per-second)- 65lps desired.
ii. Trapezoidal Shock- Transportation Environment, Non-
Operational
Sample size: 5pcs.
Condition: Sample power off.
Orientation: All six faces: Front, Rear, Left, Right, Bottom, and
Top.
Configuration: As intended for shipment
Number of shocks: 1 shock/face.
Minimum faired acceleration: 30G’s. Test also at 40 and 50G’s
to find margin.
Velocity change: 266lps (inch-per-second) for product mass (m)
20<m<40lb.
Operating vibration
Frequency
(Hz)
Slope (dB/oct)
PSD (g
2
/Hz)
5-350
0
0.0001
350-500
-6
-
500
-
0.00005
(~0.21G
nms
)
Total Test time: 10 minutes
Non-operating vibration
Frequency
(Hz)
Slope (dB/oct)
PSD (g
2
/Hz)
5.100
0
0.015
100-137
-6
-
137-350
0
0.008
350-500
-6
-
500
-
0.0039
Drop (out of box)
76cm on carpet, six-drop sequence
Drop (in box)
N/A
Approvals
CB, CE, FCC, cULus, ICES, EAC, NOM-NYCE SCT, RCM, VCCI, KC, BSMI
Ergonomic compliance
TUVGS
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
Not all configuration components are available in all regions/countries.
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Page 81
HP 655 wireless Mouse
Dimensions (H x L x W)
4.74 x 2.75 x 1.63 in (120.29 x 69.97 x41.39 mm)
Weight
0.194lb (88g)
Environmental
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
-22° to 140° F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Electrical
Operating voltage
3 VDC, +/-5%
Power consumption (typical)
10 mA Max
Resolution
1,200 DPI (Default)
Sensor
Pixart PAW3222DB-TJDS
Tracking speed
10G(max), 1G=9.8m/s2
Tracking acceleration
2.4GHz Wireless
Mechanical
Color
Jack Black
Regulatory approvals
Compliant
CB, CE, FCC, cULus, ICES, IC, TRC, TRA, ICASA, UA, EAC, CNC,
ANATEL, NOM-NYCE SCT, IFETEL, MPTC, RCM, PosTel, VCCI,
TELEC, KC, MCMC, IDA, BSMI, NCC, DWLF&M, TP-BY, MOC
Ergonomic compliance
Compliant
TUVGS
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
Not all configuration components are available in all regions/countries.
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Page 82
HP PS/2 Mouse
Dimensions (H x L x W)
4.53 x 2.48 x1.46 in (115.2x 63 x37 mm)
Weight
0.22lb (101.6g)
Environmental
Operating temperature
41° to 122° F (5° to 50° C)
Non-operating temperature
(-4° to 140° F )(-20° to 60° C)
Operating humidity
10% to 85% (non-condensing at ambient)
Non-operating humidity
5% to 95% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Electrical
Tracking speed
30 inch/sec (max)
Tracking acceleration
8G(max), 1G=9.8m/s2
System interface
PS/2
Mechanical
Switch actuation
60±15g nominal peak force with tactile feedback
Switch life
3 million keystrokes (Life tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
6 ft (1.8 m)
Color
Jack Black
Regulatory approvals
Compliant
UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Input/Output Devices
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 83
HP USB 125 (Antimicrobial)/128 Laser Mouse (China only)
Dimensions (H x L x W)
112 x 63 x 36.2 mm (L x W x H)
Weight
85 g
Environmental
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
-22° to 140° F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Electrical
Operating voltage
5 VDC, +/-5%
Power consumption (typical)
100mA
Resolution
1,200 DPI
Sensor
Optical/ Laser USB mouse sensor
Tracking speed
30 inch/sec (max)
Tracking acceleration
8G(max), 1G=9.8m/s2
Mechanical
Connector
USB
Cable length
6 ft (1.8 m)
Color
Jack Black
Regulatory approvals
Compliant
UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC, EAC
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Audio/Multimedia
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 84
AUDIO/MULTIMEDIA
HP Pro Mini 400 G9 Desktop PC
Type
Integrated
HD Stereo Codec
Realtek ALC3252
Audio I/O Ports
Front: Headset connector supports a CTIA and OMTP headset and is retaskable as a Line-in, Line-
out, Microphone-in or Headphone-out port
Internal Speaker Amplifier
2W class D mono amplifier for the internal speaker only. External speakers must be powered
Multi-streaming Capable
Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the front jacks or integrated speaker.
Sampling
Supports resolutions from 16 to 24-bit; 44.1 kHz
to 192 kHz for DAC and ADC
Wavetable Syntheses
Yes - Uses OS soft wavetable
Analog Audio
Yes
# of Channels on Line-Out
Stereo (Left & Right channels)
Internal Speaker
Yes
HP Pro SFF 400 G9 Desktop PC
Type
Integrated
HD Stereo Codec
Realtek ALC3252
Audio I/O Ports
Front: Headset connector supports a CTIA and OMTP headset and is retaskable as a Line-in, Line-
out, Microphone-in or Headphone-out port
Rear: Audio line-in/line-out jack connector*, 3.5mm and support stereo output and retasking
Internal Speaker Amplifier
2W class D mono amplifier for the internal speaker only. External speakers must be powered
Multi-streaming Capable
Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the front and rear jacks or integrated speaker.
Sampling
Supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and ADC
Wavetable Syntheses
Yes - Uses OS soft wavetable
Analog Audio
Yes
# of Channels on Line-Out
Stereo (Left & Right channels)
Internal Speaker
Yes
*NOTE: System default is line-out. Line-in / Line-out can be adjusted through the audio setting
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Audio/Multimedia
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 85
HP Pro Tower 400/480 G9 PCI Desktop PC
Type
Integrated
HD Stereo Codec
Realtek ALC3252
Audio I/O Ports
Front: Headset connector supports a CTIA and OMTP headset and is retaskable as a Line-in, Line-
out, Microphone-in or Headphone-out port
Rear: Audio line-in/line-out jack connector*, 3.5mm and support stereo output and retasking
Internal Speaker Amplifier
2W class D mono amplifier for the internal speaker only. External speakers must be powered
Multi-streaming Capable
Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the front and rear jacks or integrated speaker.
Sampling
Supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and ADC
Wavetable Syntheses
Yes - Uses OS soft wavetable
Analog Audio
Yes
# of Channels on Line-Out
Stereo (Left & Right channels)
Internal Speaker
Yes
*NOTE: System default is line-out. Line-in / Line-out can be adjusted through the audio setting
HP ProOne 440 G9 24 All-in-One PC
Type
Integrated
HD Stereo Codec
Realtek ALC3252
Audio I/O Ports
Side 3.5mm headset connector supports an OMTP or CTIA style headset and is re-taskable as a
Line-in, Line-out, Microphone-in or Headphone-out port
Internal Speaker Amplifier
2W per channel class D stereo amplifier for the internal speakers only
Multi-streaming Capable
Playback multi-streaming allows independent audio streams to be sent to/from the side jack and
integrated speakers.
Sampling
Supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and ADC
Wavetable Syntheses
Yes – Uses OS Soft Wavetable
Analog Audio
Yes
# of Channels on Line-Out
Stereo (Left & Right channels)
Internal Speaker
Yes - Stereo
INTEGRATED WEBCAM AND MICROPHONE
Optional integrated 5 MP RGB webcam & microphone; maximum resolution of 2592 x 1944
Optional integrated 5 MP RGB webcam with IR sensor & microphone; maximum resolution of 2592 x 1944
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Power
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 86
POWER
Mini
SFF
TWR
AiO
External Power Supplies
1
90W EPS, active PFC, 88%
average efficiency at
115V & 89% at 230Vac
N/A
N/A
120W EPS, active PFC,
88% average efficiency
at 115V & 89% at
230Vac
150W EPS, active PFC,
88% efficiency in
115Vac / 89%
efficiency in 230Vac
180W EPS, active PFC,
88% average efficiency
at 115V & 89% at
230Vac
230W EPS, active PFC,
89% average efficiency
at 115V / 230Vac
280W EPS, active PFC,
89% average efficiency
at 115V / 230Vac
80 PLUS Gold
N/A
180W active PFC / 80
PLUS Gold
87/90/87% efficient at
20/50/100% load
(115V)
90/92/89% efficient at
20/50/100% load
(230V)
180W active PFC / 80
PLUS Gold
87/90/87% efficient at
20/50/100% load
(115V)
90/92/89% efficient at
20/50/100% load
(230V)
N/A
80 PLUS Platinum
N/A
240W active PFC / 80
PLUS Platinum
90/92/89% efficient at
20/50/100% load
(115V)
91/93/90% efficient at
20/50/100% load
(230V)
260W active PFC / 80
PLUS Platinum
400Wactive PFC / 80
PLUS Platinum
90/92/89% efficient at
20/50/100% load
(115V)
91/93/90% efficient at
20/50/100% load
(230V)
N/A
Operating Voltage Range
90Vac~264Vac
90Vac~264Vac
90Vac~264Vac
90Vac~264Vac
Rated Voltage Range
100Vac~240Vac
100Vac~240Vac
100Vac~240Vac
100Vac~240Vac
Rated Line Frequency
50HZ~60HZ
50HZ~60HZ
50HZ~60HZ
50HZ~60HZ
Operating Line Frequency
47HZ~63HZ
47HZ~63HZ
47HZ~63HZ
47HZ~63HZ
Rated Input Current with
Energy Efficient* Power
Supply
90W≦1.7A
180W Gold ≦ 2.3A
240W Platinum ≦ 2.9A
180W≦2.3A
260W≦3.1A
400W≦5.2A
120W≦1.7A
150W≦2.5A
180W≦2.5A
230W≦3.5A
DC Output
+19.5V
+12V
+12V
+19.5V
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Power
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 87
Current Leakage (NFPA 99:
2012)
Less than 500 microamps
of leakage current at 264
Vac with the ground wire
disconnected, as required
for Non-patient Electrical
Appliances and
Equipment used in a
patient care facility or
that contact patients in
normal use. Per section
10.3.5.1.
Less than 100 microamps
of leakage current at 264
Vac with the ground wire
intact with normal
polarity, as required for
Non-patient Electrical
Appliances and
Equipment used in a
patient care facility or
that contact patients in
normal use. Per section
10.3.5.1.
Less than 500
microamps of leakage
current at 264 Vac with
the ground wire
disconnected, as
required for Non-
patient Electrical
Appliances and
Equipment used in a
patient care facility or
that contact patients in
normal use. Per section
10.3.5.1.
Less than 100
microamps of leakage
current at 264 Vac with
the ground wire intact
with normal polarity, as
required for Non-
patient Electrical
Appliances and
Equipment used in a
patient care facility or
that contact patients in
normal use. Per section
10.3.5.1.
Less than 500
microamps of leakage
current at 264 Vac with
the ground wire
disconnected, as
required for Non-
patient Electrical
Appliances and
Equipment used in a
patient care facility or
that contact patients in
normal use. Per section
10.3.5.1.
Less than 100
microamps of leakage
current at 264 Vac with
the ground wire intact
with normal polarity, as
required for Non-
patient Electrical
Appliances and
Equipment used in a
patient care facility or
that contact patients in
normal use. Per section
10.3.5.1.
Less than 500
microamps of leakage
current at 264 Vac with
the ground wire
disconnected, as
required for Non-
patient Electrical
Appliances and
Equipment used in a
patient care facility or
that contact patients in
normal use. Per section
10.3.5.1.
Less than 100
microamps of leakage
current at 264 Vac with
the ground wire intact
with normal polarity, as
required for Non-
patient Electrical
Appliances and
Equipment used in a
patient care facility or
that contact patients in
normal use. Per section
10.3.5.1.
Power Supply Fan
N/A
50mm variable speed
70mm variable speed
N/A
Power cord length*
6.0 ft. (1.83 m)
6.0 ft. (1.83 m)
6.0 ft. (1.83 m)
6.0 ft. (1.83 m)
Dimensions
90W: 126 x 50 x 30 mm
200 x 85 x 53 mm
165 x 95 x 73 mm
120W: 138mm x
68.5mm x 25.4mm
150W: 148 x 75.5 x
25.4mm
180W: 165.5mm x
79mm x 25.4mm
230W: 180mm x 88mm
x 25.4mm
1. External power supplies, power cords, cables and peripherals are not low halogen. Service parts obtained after purchase may not be low
halogen.
*NOTE: 2m for India
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Power
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 88
The power supply shall comply with harmonic input current requirements as detailed in EN61000-3-2 and JEIDA MITI standards.
The harmonic input current requirements must be met under the following operating conditions:
Load Requirements: 50% and 100%
Input Voltage: 230Vac/50Hz.
For active power factor correction the power factor at 50% &100% loads shall be greater than 0.9 over the entire nominal input
voltage range (100-127VAC and 200-240VAC).
Condition
Standard Efficiency
82/85/82%
85/88/85%
87/90/87%
90/92/89%
Input Voltage
10% of Rated Load
-
75%
81%
84%
86%
115Vac/60HZ
20% of Rated Load
-
82%
85%
87%
90%
115Vac/60HZ
50% of Rated Load
-
85%
88%
90%
92%
115Vac/60HZ
PF>0.9
PF>0.9
PF>0.9
PF>0.9
PF>0.95
PF>0.9
PF>0.9
PF>0.9
PF>0.9
PF>0.9
230Vac/50HZ
100% of Rated
Load
70%
82%
85%
87%
89%
115Vac/60HZ
PF>0.9
PF>0.9
PF>0.9
PF>0.9
PF>0.9
230Vac/50HZ
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Weights and Dimensions
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 89
WEIGHTS & DIMENSIONS
1
DM
SFF
Chassis (W x D x H)
6.97 x 6.89 x 1.35 in
177 x 175 x 34.2 mm
10.63 x 12.12 x 3.74 in
270 x 308 x 95 mm
System Volume
64 cu in
1.05 L
481.85 cu in
7.9 L
System Weight
1
2.74 lb
1.25 kg
9.59 lb
4.35 kg
Max Supported Weight
(desktop orientation)
N/A
9.55 lb
4.38 kg
Packaging Dimension (WxDxH)
19.57 x 5.04 x 8.78 in
(497 x 128 x 223 mm)
15.52 x 19.65 x 8.07 in
(394 x 499 x 205 mm)
MPP*: 19.61 x 9.25 x 5.20 in
(498 x 235 x 132 mm)
MPP*: 15.52 x 19.65 x 8.07 in
(394 x 499 x 205 mm)
Shipping Weight
6.52 lb (2.97 kg)
15.31 lb (6.95 kg)
MPP*: 7.50 lb (3.40 kg)
MPP*: 15.97 lb (7.25 kg)
Palletization Profile (Fabricated EPE)
18-units per layer
5 or 6 layers max depending on details
of air freight
90 or 108 units per pallet depending on
details of air freight
45.354 x 39.13 x 57.80 in, 1152 x 994 x
1468 mm (including pallet)
6-units per layer
11 layer max
66 per pallet
47.24 x 39.37 x 94.63 in,
1200 x 1000 x 2412 mm
(including pallet)
Palletization Profile** (Molded Pulp)
10-units per layer
10 to 19 layers max depending on
details of freight
100 or 190 units per pallet depending
on details of freight
46.26 x 39.21 x 103.74 in, 1175 x 996 x
2635 mm (including pallet)
6-units per layer
11 layer max
66 per pallet
47.24 x 39.37 x 94.63 in, 1200 x 1000 x
2412 mm (including pallet)
1. Packaging material used will vary by country
2. Configured with 1 HDD & 1 ODD; DM configured with 1 HDD only
*NOTE: “Molded pulp paper” cushion.
**NOTE: The palletization is for single pack
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Weights and Dimensions
Not all configuration components are available in all regions/countries.
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Page 90
TWR
Chassis (W x D x H)
6.1 x 12.13 x 13.27 in
155x 308 x 337 mm
System Volume
981.9 cu in
16.1 L
System Weight
1
11.7 lb
5.31 kg
Max Supported Weight
(desktop orientation)
11.2 lb
5.08 kg
Packaging Dimension
(W x D x H)
15.75 x 19.65 x 11.30 in
(400 x 499 x 287 mm)
MPP: 15.75 x 19.65 x 11.30 in
(400 x 499 x 287 mm)
Shipping Weight
17.69 lb (8.03 kg)
MPP: 18.5 lb (8.4 kg)
Palletization Profile (Fabricated EPE)
6-units per layer
8 layer max
48 per pallet
47.24 x 39.37 x 95.12 in, 1200 x 1000 x
2416 mm (including pallet)
Palletization Profile (Molded Pulp)
6-units per layer
8 layer max
48 per pallet
47.24 x 39.37 x 95.12 in, 1200 x 1000 x
2416 mm (including pallet)
1. Packaging material used will vary by country
2. Configured with 1 HDD & 1 ODD; DM configured with 1 HDD only
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Technical Specifications – Weights and Dimensions
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 91
ALL-IN-ONE DIMENSIONS
1
Without Stand
(VESA Cover Plate)
Cantilever Stand
(Fixed Height Tilt Stand)
Adjustable Height Stand
cm/kg
inch/lb
cm/kg
inch/lb
cm/kg
inch/lb
Product
Width
53.93 cm
21.23 in
53.93 cm
21.23 in
53.93 cm
21.23 in
Length/Depth
8.96 cm
3.53 in
18.70 cm
7.36 in
22.5 cm
8.85 in
Height
35.36 cm
13.92 in
40.28 cm
15.85 in
37.94 ~ 50.94
cm
14.93 ~ 20.05 in
Weight
6.93 kg
15.28 lb
7.315 kg
16.12 lb
7.775kg
17.57 lb
Package
Width
66.0 cm
25.98 in
66.0 cm
25.98 in
66.0 cm
25.98 in
Length/Depth
19.5 cm
7.67 in
19.5 cm
7.67 in
19.5 cm
7.67 in
Height
46.2 cm
18.19 in
46.2 cm
18.19 in
46.2 cm
18.19 in
Weight
10.87 kg
23.96 lb
11.59 kg
25.55 lb
12.12 kg
26.72 lb
Palletization
for Sea/Rail
Width
120.0 cm
47.24 in
120.0 cm
47.24 in
120.0 cm
47.24 in
Length/Depth
100.0 cm
39.37 in
100.0 cm
39.37 in
100.0 cm
39.37 in
Height
198.8 cm
78.27 in
198.8 cm
78.27 in
198.8 cm
78.27 in
Weight
319.36 kg
704.06 lb
324.52 kg
715.44 kg
354.36 kg
718.22 lb
Qty / Layer
7
7
7
Layers
4
4
4
Qty / Pallet via Sea/Rail
28
28
28
Qty / Pallet via Air
21
21
21
1. Packaging material used will vary by country.
2. Configured with 1 HDD & 1 ODD.
3. Package weight is based on EPE package.
4. Actual system weight will depend on the system configuration.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Miscellaneous Features
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 92
MISCELLANEOUS FEATURES
Management Features
• Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or
powered-off state without affecting other elements of the system.
• Intel® Wired for Management support; industry wide initiative to make Intel® architecture based PCs, servers and mobile
computers more inherently manageable out-of-the-box and over the network
• Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button
Serviceability Features
• Dual colored power LED on front of computer to indicate either normal or fault condition
• Diagnostic LED Explanation Table:
o Power LED will blink red 2 to 5 times, then blink white 2 or more times, then repeat (with beep tones for each
blink initially):
▪ 2 red + 2 white User must provide file for BIOS recovery (USB storage typically)
▪ 2 red + 3 white User must enter a key sequence to proceed with recovery by policy
▪ 2 red + 4 white BIOS recovery is in progress
▪ 3 red + 2 white Memory could not be initialized
▪ 3 red + 3 white Graphics adaptor could not be found
▪ 3 red + 4 white Power supply failure / not connected
▪ 3 red + 5 white Processor not installed
▪ 3 red + 6 white Current processor does not support an enabled feature
▪ 4 red + 2 white Processor has exceeded its temperature threshold / system thermal shutdown
▪ 4 red + 3 white System internal temperature has exceeded its threshold
▪ 5 red + 2 white System controller firmware is not valid
▪ 5 red + 3 white System controller detected BIOS is not executing
▪ 5 red + 4 white BIOS could not complete initialization / mainboard failure
▪ 5 red + 5 white System controller rebooted the system after a health or recovery timer triggered
• HP PC Hardware Diagnostics UEFI:
o This utility enables hardware level testing outside the operating system on many components. The diagnostics
can be invoked by pressing F2 at POST, and is available as a download from HP Support
• System/Emergency ROM
• Flash ROM
• CMOS Battery Holder for easy replacement
• Flash Recovery with Video Configuration Record Software
• 1 Aux Power LED on System PCA
• Processor ZIF Socket for easy Upgrade
• Over-Temp Warning on Screen (Requires IM Agents)
• DIMM Connectors for easy Upgrade
• Clear CMOS Button
• NIC LEDs (integrated) (Green & Amber)
• Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions
• Color coordinated cables and connectors
• Tool-less Hood Removal
• Front power switch
• System memory can be upgraded without removing the system board or any internal components
• Tool-less Hard Drive, memory & optical drive Removal (For MT, SFF, and DM only)
• Green Pull Tabs, and Quick Release Latches for easy Identification
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Miscellaneous Features
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 93
Additional Features
Description
Product Orientation
Microtower (MT) can be oriented in a tower (vertical) orientation.
Small Form Factor (SFF) can be oriented as either a desktop (horizontal) or a tower
(vertical) with optional vertical stand.
Desktop Mini (DM) can be oriented as either a desktop (horizontal) or a tower (vertical)
with optional vertical stand.
Boot Sectors Protection
MBR and GPT sectors of the hard drive are critical to booting the operating system. By
saving the MBR or GPT data (depending on the how the OS was installed), the BIOS will
be able to monitor for changes and allow the user to override them with the backup
copy at boot-up.
Drive Protection System
DPS Access through F10 Setup during Boot
A diagnostic hard drive self- test. It scans critical physical components and every sector
of the hard drive for physical faults and then reports any faults to the user
Running independently of the operating system, it can be accessed through a Windows-
based diagnostics utility or through the computer's setup procedure. It produces an
evaluation on whether the hard drive is the source of the problem and needs to be
replaced
The system expands on the Self-Monitoring, Analysis, and Reporting Technology
(SMART), a continuously running systems diagnostic that alerts the user to certain
types of failures
SMART Technology (Self-Monitoring,
Analysis and Reporting Technology)
Allows hard drives to monitor their own health and to raise flags if imminent failures
were predicted
SMART I - Drive Failure Prediction
Predicts failures before they occur. Tracks fault prediction and failure indication
parameters such as re-allocated sector count, spin retry count, calibration retry count
SMART II - Off-Line Data Collection
By avoiding actual hard drive failures, SMART hard drives act as "insurance" against
unplanned user downtime and potential data loss from hard drive failure
SMART III - Off-Line Read Scanning with
Defect Reallocation
IOEDC: I/O Error Detection Circuitry
SMART IV - End-to-End CRC for hard
drives
Detects errors in Read/Write buffers on HDD cache RAM
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
After Market Options
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 94
AFTER MARKET OPTIONS
Graphics Solutions
Mini
SFF
TWR
AiO
Part Number
NVIDIA T400 4GB GDDR6 3mDP
X
X
5Z7E0AA
AMD Radeon RX 6300 2GB GDDR6 DP+HDMI FH
X
7Y6P7AA
AMD Radeon RX 6300 2GB GDDR6 DP+HDMI LP
X
803S9AA
Intel Arc A380 6GB GDDR6 FH PCIe x16 3DP+HDMI
X
9Q6G0AA
HP DisplayPort™ To HDMI True 4k Adapter
X
X
X
X
2JA63AA
HP HDMI Standard Cable Kit
X
X
X
X
T6F94AA
HP DisplayPort™ Cable Kit
X
X
X
X
VN567AA
HP DisplayPort™ To VGA Adapter
X
X
X
X
AS615AA
HP DisplayPort™ To DVI-D Adapter
X
X
X
X
FH973AA
Desktop Mini Accessories
Mini
SFF
TWR
AiO
Part Number
HP Desktop Mini 2.5" SATA Drive Bay kit v2
X
13L70AA
HP Desktop Mini LockBox V2
X
3EJ57AA
HP Desktop Mini DVD-Writer ODD Expansion Module
X
K9Q83AA
HP Desktop Mini v4+ VESA Sleeve
X
99T54AA
HP Desktop Mini v4+ VESA Sleeve with Power Supply
Holder
X
99T55AA
HP B250 PC Mounting Bracket
X
8RA46AA
HP B200 PC Mounting Bracket
X
762T5AA
HP B300 PC Mounting Bracket
X
2DW53AA
HP B300 PC Mounting Bracket with Power Supply
Holder
X
7DB37AA
HP Desktop Mini Vertical Chassis Stand
X
G1K23AA
B550 PC Mounting Bracket
X
16U00AA
HP B560 PC Mounting Bracket
X
763U8AA
HP Quick Release Bracket 2
X
6KD15AA
Data Storage Drives
Mini
SFF
TWR
AiO
Part Number
HP PCIe Gen 4 NVME TLC M.2 512GB SSD
X
X
X
X
406L8AA
HP PCIe Gen 4 NVME TLC M.2 1TB SSD
X
X
X
X
406L7AA
HP 1TB 7200rpm SATA 6Gb/s 3.5” Hard Drive
X
X
QK555AA
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
After Market Options
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 95
Input Devices
Mini
SFF
TWR
AiO
Part Number
HP Wired Desktop 320K Keyboard
X
X
X
X
9SR37AA
HP USB Business Slim CCID SmartCard Keyboard
X
X
X
X
Z9H48AA
HP Wired Desktop 320MK Mouse and Keyboard
X
X
X
X
9SR36AA
HP Wired Desktop 320M Mouse
X
X
X
X
9VA80AA
HP 655 Wireless Keyboard and Mouse Combo
X
X
X
X
4R009AA
HP 455 Programmable Wireless Keyboard
X
X
X
X
4R177AA
HP 125 Wired Keyboard
X
X
X
X
266C9AA
HP 125 Wired Mouse
X
X
X
X
265A9AA
HP 128 Laser Wired Mouse
X
X
X
X
265D9AA
HP 225 Wired Mouse and Keyboard Combo
X
X
X
X
286J4AA
HP 225 Antimicrobial Wired Mouse and Keyboard
Combo (China Only)
X
X
X
X
286K3AA
System Memory
Mini
SFF
TWR
AiO
Part Number
HP 4GB DDR4-3200 UDIMM
X
X
13L78AA
HP 8GB DDR4-3200 UDIMM
X
X
13L76AA
HP 16GB DDR4-3200 UDIMM
X
X
13L74AA
HP 32GB DDR4-3200 UDIMM
X
X
13L72AA
HP 4GB DDR4-3200 SODIMM
X
X
13L79AA
HP 8GB DDR4-3200 SODIMM
X
X
13L77AA
HP 16GB DDR4-3200 SODIMM
X
X
13L75AA
HP 32GB DDR4-3200 SODIMM
X
X
13L73AA
HP 8GB DDR5-4800 UDIMM
X
X
4M9X9AA
HP 16GB DDR5-4800 UDIMM
X
X
4M9Y0AA
HP 32GB DDR5-4800 UDIMM
X
X
4M9Y2AA
HP 8GB DDR5-4800 SODIMM
X
X
4M9Y4AA
HP 16GB DDR5-4800 SODIMM
X
X
4M9Y5AA
HP 32GB DDR5-4800 SODIMM
X
X
4M9Y7AA
HP 8GB DDR5-5600 SODIMM
X
X
79U70AA
HP 16GB DDR5-5600 SODIMM
X
X
79U71AA
HP 32GB DDR5-5600 SODIMM
X
X
79U72AA
Multimedia Devices
Mini
SFF
TWR
AiO
Part Number
HP S101 Speaker Bar
X
X
5UU40AA
HP Z G3 Conferencing Speaker Bar
X
X
X
32C42AA
HP Stereo 3.5mm Headset G2
X
X
X
428K7AA
HP Stereo USB Headset G2
X
X
428K6AA
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
After Market Options
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 96
Communication Devices
Mini
SFF
TWR
AiO
Part Number
Intel® Ethernet I225-T1 GbE NIC
X
X
406L9AA
Intel® Ethernet I226-T1 2.5GbE NIC
X
X
9P1U8AA
Security Devices
Mini
SFF
TWR
AiO
Part Number
HP Business PC Security Lock v3 Kit
X
X
3XJ17AA
HP Keyed Cable Lock 10mm
X
X
X
X
T1A62AA
Stands and Mounting Accessories
Mini
SFF
TWR
AiO
Part Number
HP B250 PC Mounting Bracket
X
8RA46AA
HP B300 PC Mounting Bracket
X
2DW53AA
HP B550 PC Mounting Bracket
X
16U00AA
HP Quick Release Bracket 2
X
X
6KD15AA
HP ProOne G9 VESA Plate with Power Supply Holder
X
56P78AA
I/O Devices
Mini
SFF
TWR
AiO
Part Number
HP DisplayPort Port Flex IO v2
X
X
X
13L54AA
800 G9 SATA Power Cable Non RF
X
8H5A4AA
400 G9 SATA Power Cable Non RF
X
8H5A3AA
HP HDMI Port Flex IO v2
X
X
X
13L55AA
HP Type-C USB 3.1 Gen2 Port Flex IO v2
X
X
13L59AA
HP Type-C USB 3.1 Gen2 Port with 100W PD Flex IO v2
X
13L60AA
HP VGA Port Flex IO v2
X
X
X
13L53AA
HP Serial Port Flex IO 2nd
X
13L57AA
HP PCIe x1 Parallel Port Card
X
X
N1M40AA
HP 800/600/400 G3 Serial/ PS/2 Adapter
X
X
1VD82AA
HP USB to Serial Port Adapter
X
X
X
X
J7B60AA
HP Serial Port Flex IO v3
X
X
X
5B895AA
HP USB-C To DisplayPort Adapter
X
X
N9K78AA
HP Single Mini Display Port Adapter to Display Port
Adapter
X
X
2MY05AA
NOTE: For more detail on HP I/O Devices please refer to the HP FLEX IO Option Cards QuickSpecs. URL is:
http://h20195.www2.hp.com/v2/GetDocument.aspx?docname=c06042607
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 97
© Copyright 2024 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein
should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions
contained herein. Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other
countries. Intel, Celeron, Core, Pentium are registered trademarks or trademarks of Intel® Corporation in the U.S. and/or other
countries. Bluetooth
®
is a trademark of its proprietor, used by HP, Inc. under license. USB Type-C™ and USB-C™ are trademarks of
USB Implementers Forum. NVIDIA, GeForce and NVS are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S.
and other countries. AMD and Radeon are trademarks of Advanced Micro Devices, Inc. ENERGY STAR is a registered trademark
owned by the U.S. Environmental Protection Agency. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video
Electronics Standards Association (VESA®) in the United States and other countries.
QuickSpecs
HP Pro Series 400 G9 Desktops PCs
Change Log
Not all configuration components are available in all regions/countries.
c08017709 – DA 16998 – Worldwide — Version 6 — July 22, 2024
Page 98
Date
Version History
Action
Description of Change
April 26, 2024
From v1 to v2
Update
T400 cards multi display support updated to 3
April 29, 2024
From v2 to v3
Replacement
Intel® I225-LM 2.5 for Intel FoxPond1 I225-T1 2.5GbE
May 3, 2024
From v3 to v4
Removal
HP Desktop Mini Port Cover v3 from AMO section
May 8, 2024
From v4 to v5
Removal
DDR5-5600 64GB 2SO-DIMM card from Memory section
July 22, 2024
From v5 to v6
Correction
Integrated SATA storage connector corrected checked for AiO
From v6 to v7
From v7 to v8
From v8 to v9
From v9 to v10
From v10 to v11
From v11 to v12
From v12 to v13
From v13 to v14
From v14 to v15
From v15 to v16
From v16 to v17
From v17 to v18
From v18 to v19
From v19 to v20
From v20 to v21
From v21 to v22
From v22 to v23